ISL1208IRT8Z Datasheet, PDF (22/24 Pages) Intersil Corporation – Low Power RTC with Battery Backed SRAM

ISL1208
Thin Dual Flat No-Lead Plastic Package (TDFN)
2X
A
D
0.15 C A
2X
0.15 C B
E
6
INDEX
AREA
TOP VIEW
B
C
SEATING
PLANE
SIDE VIEW
(DATUM B)
6
INDEX
AREA
(DATUM A)
D2
D2/2
12
// 0.10 C
A
0.08 C
A3
78
NX k
E2
E2/2
NX (b)
5
NX L
8
N N-1
e
(Nd-1)Xe
REF.
BOTTOM VIEW
NX b
5
0.10 M C A B
CL
(A1)
L1
10 ^L
SECTION "C-C"
e
TERMINAL TIP
FOR EVEN TERMINAL/SIDE
L8.3x3A
8 LEAD THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
MILLIMETERS
SYMBOL
MIN
NOMINAL MAX
NOTES
A
0.70
0.75
0.80
-
A1
-
0.02
0.05
-
A3
0.20 REF
-
b
0.25
0.30
0.35
5, 8
D
3.00 BSC
-
D2
2.20
2.30
2.40
7, 8, 9
E
3.00 BSC
-
E2
1.40
1.50
1.60
7, 8, 9
e
0.65 BSC
-
k
0.25
-
-
-
L
0.20
0.30
0.40
8
N
8
2
Nd
4
3
NOTES:
Rev. 3 11/04
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd refers to the number of terminals on D.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
9. Compliant to JEDEC MO-WEEC-2 except for the “L” min
dimension.
22
FN8085.8
September 12, 2008