ICL3232CVZ-T Datasheet, PDF (21/28 Pages) Intersil Corporation – One Microamp Supply-Current, +3V to +5.5V, 250kbps, RS-232 Transmitters/Receivers

ICL3221, ICL3222, ICL3223, ICL3232, ICL3241, ICL3243
Small Outline Plastic Packages (SSOP)
N
INDEX
AREA
H
E
-B-
0.25(0.010) M B M
GAUGE
PLANE
123
-A-
D
SEATING PLANE
A
L
0.25
0.010
-C-
α
e
A1
A2
C
B
0.10(0.004)
0.25(0.010) M C A M B S
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm (0.0078
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.20mm (0.0078 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of “B” dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
M16.209 (JEDEC MO-150-AC ISSUE B)
16 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
-
A2
0.065 0.072 1.65
1.85
-
B
0.009 0.014 0.22
0.38
9
C
0.004 0.009 0.09
0.25
-
D
0.233 0.255 5.90
6.50
3
E
0.197 0.220 5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292 0.322 7.40
8.20
-
L
0.022 0.037 0.55
0.95
6
N
16
16
7
α
0°
8°
0°
8°
-
Rev. 3 6/05
21
FN4805.21
March 1, 2006