X60008B-25_06 Datasheet, PDF (2/10 Pages) Intersil Corporation – Precision 2.5V FGA™ Voltage Reference

PACKAGE DIAGRAM
X60008B-25
GND
V_IN
DNC
GND
X60008-XX
SOIC
1
8
2
7
3
6
4
5
DNC
DNC
V_OUT
DNC
PIN CONFIGURATIONS
Pin Name
GND
V_IN
V_OUT
DNC
Description
Ground Connection
Power Supply Input Connection
Voltage Reference Output Connection
Do Not Connect; Internal Connection – Must Be Left Floating
Ordering Information
PART NUMBER
X60008BIS8-25*
X60008BIS8Z-25*
(Note)
X60008CIS8-25
X60008CIS8Z-25*
(Note)
X60008DIS8-25*
X60008DIS8Z-25*
(Note)
PART
MARKING
X60008B I25
X60008B ZI25
X60008C I25
X60008C ZI25
X60008D I25
X60008D ZI25
V_OUT (V)
2.5
2.5
2.5
2.5
2.5
2.5
GRADE
±0.5mV, 3ppm/°C
±0.5mV, 3ppm/°C
±0.5mV, 5ppm/°C
±0.5mV, 5ppm/°C
±1.0mV, 10ppm/°C
±1.0mV, 10ppm/°C
TEMPERATURE
RANGE (°C)
PACKAGE
-40 to +85
8 Ld SOIC (150 mil)
-40 to +85
8 Ld SOIC (150 mil)
(Pb-free)
-40 to +85
8 Ld SOIC (150 mil)
-40 to +85
8 Ld SOIC (150 mil)
(Pb-free)
-40 to +85
8 Ld SOIC (150 mil)
-40 to +85
8 Ld SOIC (150 mil)
(Pb-free)
PKG. DWG. #
MDP0027
MDP0027
MDP0027
MDP0027
MDP0027
MDP0027
*Add "T1" suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2
FN8140.1
May 24, 2006