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RFP15N05L Datasheet, PDF (2/5 Pages) Fairchild Semiconductor – 15A, 50V and 60V, 0.140 Ohm, Logic Level N-Channel Power MOSFETs
RFP15N05L, RFP15N06L
Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS
Maximum Power Dissipation . . . . . .
Above TC = 25oC, Derate Linearly
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PD
...
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TJ, TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg
RFP15N05L
50
50
15
40
±10
60
0.48
-55 to 150
RFP15N06L
60
60
15
40
±10
60
0.48
-55 to 150
UNITS
V
V
A
A
V
W
W/oC
oC
300
300
oC
260
260
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25oC to 125oC.
Electrical Specifications TC = 25oC, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
Drain to Source Breakdown Voltage
RFP15N05L
BVDSS ID = 250µA, VGS = 0V
RFP15N06L
Gate Threshold Voltage
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
Drain to Source On Resistance (Note 2)
Input Capacitance
Output Capacitance
Reverse-Transfer Capacitance
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
VGS(TH)
IDSS
IGSS
rDS(ON)
CISS
COSS
CRSS
td(ON)
tr
td(OFF)
tf
RθJC
VGS = VDS, ID = 250µA (Figure 7)
VDS = 48V, VDS = 50V
VDS = 48V, VDS = 50V
TC = 125oC
VGS = ±10V, VDS = 0V
ID = 15A, VGS = 5V (Figures 5, 6)
VDS = 25V, VGS = 0V, f = 1MHz
(Figure 8)
VDD = 30V, ID = 7.5A, RG = 6.25Ω
(Figures 10, 11)
VGS = 5V
RFP15N05L, RFP15N06L
Source to Drain Diode Specifications
PARAMETER
SYMBOL
TEST CONDITIONS
Source to Drain Diode Voltage (Note 2)
VSD
ISD = 7.5A
Diode Reverse Recovery Time
trr
ISD = 4A, dISD/dt = 100A/µs
NOTE:
2. Pulsed: pulse duration = ≤ 300µs maximum, duty cycle = ≤ 2%.
3. Repititive rating: pulse width limited by maximum junction temperature.
6-230
MIN TYP MAX UNITS
50
-
-
V
60
-
-
V
1
-
2
V
-
-
1
µA
-
-
50
µA
-
-
100
nA
-
-
0.140
Ω
-
-
900
pF
-
-
450
pF
-
-
200
pF
-
16
40
ns
-
250 325
ns
-
200 325
ns
-
225 325
ns
-
-
2.083 oC/W
MIN TYP MAX UNITS
-
-
1.4
V
-
225
-
ns