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RFP14N06 Datasheet, PDF (2/8 Pages) Intersil Corporation – 14A, 60V, 0.100 Ohm, N-Channel Power MOSFET
RFP14N06
Absolute Maximum Ratings TC = 25oC Unless Otherwise Specified
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS
Continuous Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
Pulsed Drain Current (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Linear Derating Factor Above TC = 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, See Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg
RFP14N06
60
60
±20
14
Refer to Peak Current Curve
Refer to UIS Curve
48
0.32
-55 to 175
300
260
UNITS
V
V
V
A
W
W/oC
oC
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25oC to 150oC.
Electrical Specifications TC = 25oC, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
Drain to Source Breakdown Voltage
Gate Threshold Voltage
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
Drain to Source On Resistance (Note 2)
Turn-On Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-Off Time
Total Gate Charge
Gate Charge at 10V
Threshold Gate Charge
BVDSS ID = 250µA, VGS = 0V (Figure 11)
60
VGS(TH) VGS = VDS, ID = 250µA, (Figure 10)
2
IDSS VDS = Rated BVDSS, VGS = 0V
-
VDS = 0.8 x Rated BVDSS, VGS = 0V, TC = 150oC -
IGSS VGS = ±20V
-
rDS(ON) ID = 14A, VGS = 10V, (Figure 9)
-
tON
VDD =30V, ID = 7A, RL = 4.3Ω,
-
td(ON)
VGS = 10V, RGS = 25Ω
(Figure 13)
-
tr
-
td(OFF)
-
tf
-
tOFF
-
Qg(TOT) VGS = 0V to 20V VDD = 48V, ID = 14A,
-
Qg(10)
VGS = 0V to 10V
RL = 3.42Ω,
IG(REF) = 0.4mA
-
Qg(TH) VGS = 0V to 2V
(Figure 13)
-
Input Capacitance
Output Capacitance
CISS VDS = 25V, VGS = 0V, f = 1MHz
-
COSS (Figure 12)
-
Reverse Transfer Capacitance
CRSS
-
Thermal Resistance Junction to Case
RθJC
-
Thermal Resistance Junction to Ambient
RθJA TO-220AB
-
TYP MAX UNITS
-
-
V
-
4
V
-
1
µA
-
25
µA
- ±100 nA
- 0.100 Ω
-
60
ns
14
-
ns
26
-
ns
45
-
ns
17
-
ns
-
100
ns
-
40
nC
-
25
nC
-
1.5
nC
570
-
pF
185
-
pF
50
-
pF
- 3.125 oC/W
-
62
oC/W
Source to Drain Diode Specifications
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNITS
Source to Drain Diode Voltage
VSD ISD = 14A
-
-
1.5
V
Diode Reverse Recovery Time
trr
ISD = 14A, dISD/dt = 100A/µs
-
-
125
ns
NOTES:
2. Pulse test: pulse width ≤ 300µs, duty cycle ≤ 2%.
3. Repetitive rating: pulse width limited by maximum junction temperature. See Transient Thermal Impedance curve (Figure 3) and Peak Current
Capability Curve (Figure 5).
4-493