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RFG50N06 Datasheet, PDF (2/8 Pages) Fairchild Semiconductor – 50A, 60V, 0.022 Ohm, N-Channel Power MOSFETs
RFG50N06, RFP50N06, RF1S50N06SM
Absolute Maximum Ratings TC = 25oC, Unless Otherwise Specified
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS
Continuous Drain Current (Figure 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .ID
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . IDM
Pulsed Avalanche Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . EAS
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . TL
Package Body for 10s, see Techbrief 334 . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Tpkg
RFG50N06, RFP50N06
RF1S50N06SM
60
60
±20
50
(Figure 5)
(Figure 6, 14, 15)
131
0.877
-55 to 175
300
260
UNITS
V
V
V
A
W
W/oC
oC
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. TJ = 25oC to 150oC.
Electrical Specifications TC = 25oC, Unless Otherwise Specified
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
Drain to Source Breakdown Voltage
Gate to Source Threshold Voltage
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
Drain to Source On Resistance
Turn-On Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-Off Time
Total Gate Charge
Gate Charge at 10V
Threshold Gate Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Thermal Resistance Junction to Case
Thermal Resistance Junction to Ambient
BVDSS
VGS(TH)
IDSS
IGSS
rDS(ON)
tON
td(ON)
tr
td(OFF)
tf
tOFF
Qg(TOT)
Qg(10)
Qg(TH)
CISS
COSS
CRSS
RθJC
RθJA
ID = 250µA, VGS = 0V (Figure 11)
60
VGS = VDS, ID = 250µA (Figure 10)
2
VDS = 60V,
TC = 25oC
-
VGS = 0V
TC = 150oC
-
VGS = ±20V
-
ID = 50A, VGS = 10V (Figures 9)
-
VDD = 30V, ID = 50A
-
RL = 0.6Ω, VGS = 10V
RGS = 3.6Ω
-
(Figure 13)
-
-
-
-
VGS = 0 to 20V VDD = 48V, ID = 50A, -
VGS = 0 to 10V
RL = 0.96Ω
Ig(REF) = 1.45mA
-
VGS = 0 to 2V (Figure 13)
-
VDS = 25V, VGS = 0V
-
f = 1MHz
(Figure 12)
-
-
(Figure 3)
-
TO-247
-
TO-220, TO-263
-
TYP
-
-
-
-
-
-
-
12
55
37
13
-
125
67
3.7
2020
600
200
-
-
-
MAX
-
4
1
50
±100
0.022
95
-
-
-
-
75
150
80
4.5
-
-
-
1.14
30
62
UNITS
V
V
µA
µA
nA
Ω
ns
ns
ns
ns
ns
ns
nC
nC
nC
pF
pF
pF
oC/W
oC/W
oC/W
Source to Drain Diode Specifications
PARAMETER
Source to Drain Diode Voltage
Reverse Recovery Time
SYMBOL
VSD
trr
TEST CONDITIONS
ISD = 50A
ISD = 50A, dISD/dt = 100A/µs
MIN TYP MAX UNITS
-
-
1.5
V
-
-
125
ns
4-468