ISL6594A_06 Datasheet, PDF (2/10 Pages) Intersil Corporation – Advanced Synchronous Rectified Buck MOSFET Drivers with Protection Features

ISL6594A, ISL6594B
Ordering Information
PART NUMBER
PART MARKING
TEMP.
RANGE (°C)
PACKAGE
PKG.
DWG. #
ISL6594ACB
ISL6594ACB
0 to 85
8 Ld SOIC
M8.15
ISL6594ACB-T
ISL6594ACB
8 Ld SOIC Tape and Reel
ISL6594ACBZ (Note)
6594ACBZ
0 to 85
8 Ld SOIC (Pb-free)
M8.15
ISL6594ACBZ-T (Note)
6594ACBZ
8 Ld SOIC Tape and Reel (Pb-free)
ISL6594ACR
94AC
0 to 85
10 Ld 3x3 DFN
L10.3x3
ISL6594ACR-T
94AC
10 Ld 3x3 DFN Tape and Reel
ISL6594ACRZ (Note)
94AZ
0 to 85
10 Ld 3x3 DFN (Pb-free)
L10.3x3
ISL6594ACRZ-T (Note)
94AZ
10 Ld 3x3 DFN Tape and Reel (Pb-Free)
ISL6594BCB
ISL6594BCB
0 to 85
8 Ld SOIC
M8.15
ISL6594BCB-T
ISL6594BCB
8 Ld SOIC Tape and Reel
ISL6594BCBZ (Note)
6594BCBZ
0 to 85
8 Ld SOIC (Pb-free)
M8.15
ISL6594BCBZ-T (Note)
6594BCBZ
8 Ld SOIC Tape and Reel (Pb-Free)
ISL6594BCR
94BC
0 to 85
10 Ld 3x3 DFN
L10.3x3
ISL6594BCR-T
94BC
10 Ld 3x3 DFN Tape and Reel
ISL6594BCRZ (Note)
94BZ
0 to 85
10 Ld 3x3 DFN (Pb-free)
L10.3x3
ISL6594BCRZ-T (Note)
94BZ
10 Ld 3x3 DFN Tape and Reel (Pb-free)
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are
MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Pinouts
ISL6594ACB, ISL6594BCB (SOIC)
TOP VIEW
ISL6594ACR, ISL6594BCR (10 LD 3x3 DFN)
TOP VIEW
UGATE 1
BOOT 2
PWM 3
GND 4
Block Diagram
8 PHASE
7 PVCC
6 VCC
5 LGATE
UGCARTDEL ¹
BOUOSBT 2
P^NP^/CR ³
PCWHMG ⁴
NTC or^GO^NV^DP 5
or EN
ISL6594A AND ISL6594B
10 PBAHTASE
9 PICVDCLC
8 NG/NCD
7 _VUCSBCP
6 ^LIUGSABTE
VCC
PWM
UVCC
+5V
10K
8K
Pre-POR OVP
FEATURES
POR/
CONTROL
LOGIC
SHOOT-
THROUGH
PROTECTION
(LVCC)
BOOT
UGATE
PHASE
PVCC
UVCC = VCC FOR ISL6594A
UVCC = PVCC FOR ISL6594B
LGATE
PAD
GND
FOR DFN -DEVICES, THE PAD ON THE BOTTOM SIDE OF
THE PACKAGE MUST BE SOLDERED TO THE CIRCUIT’S GROUND.
2
FN9157.3
July 31, 2006