ISL6367CRZ Datasheet, PDF (2/6 Pages) Intersil Corporation – PCN13024 – ASECL Reliability Qualification Summary

October 25, 2013
To: Our Valued Intersil Customer
Subject: Alternate Manufacturing Site for Assembly of the Listed Intersil DFN/QFN Packaged
Products – Advanced Semiconductor Engineering - Chung-Li, Taiwan (ASECL)
PCN13024B is being issued to inform customers that Intersil has updated the list of affected
products contained in notice PCN13024 that was issued on March 08, 2013. The products listed in
the table below have been removed from the notice. As such, the changes outlined in PCN13024
will not be implemented for those products. The content of the original notice, PCN13024 and
PCN13024A, with the updated product list is included for reference.
Products removed from PCN13024:
ISL6261ACRZ-TR5392 ISL6312CRZ-TR5429 ISL6326CRZ-T
ISL6333IRZ
ISL6364CRZ
ISL6262ACRZ
ISL6322GCRZ
ISL6326CRZ-TS2701 ISL6333IRZ-T
ISL6364CRZS2738
ISL6262ACRZ-T
ISL6322GCRZ-T
ISL6326CRZ-TS2705 ISL6334ACRZ
ISL6364CRZ-T
ISL6262ACRZ-TS2568 ISL6322GCRZ-TR5429 ISL6333ACRZ
ISL6334ACRZR5586 ISL6364CRZ-TS2490
ISL6262ACRZ-TS2704 ISL6323ACRZ
ISL6333ACRZ-T
ISL6334ACRZ-T
ISL6364CRZ-TS2568
ISL6266AHRZ
ISL6323ACRZR5381 ISL6333ACRZ-TS2568 ISL6334ACRZ-TR5586 ISL6364CRZ-TS2738
ISL6266AHRZ-T
ISL6323ACRZ-T
ISL6333ACRZ-TS2705 ISL6334ACRZ-TS2568 ISL6364IRZ
ISL62881HRTZ
ISL6323ACRZ-TR5381 ISL6333AIRZ
ISL6334AIRZ
ISL6364IRZ-T
ISL62881HRTZ-T
ISL6323ACRZ-TR5429 ISL6333AIRZ-T
ISL6334AIRZ-T
ISL6364IRZ-TS2705
ISL6308CRZ
ISL6323ACRZ-TS2701 ISL6333AIRZ-TS2705 ISL6334AIRZ-TS2705 ISL6366CRZ
ISL6308CRZR5372 ISL6323BCRZ
ISL6333BCRZ
ISL6334CRZ
ISL6366CRZ-T
ISL6308CRZR5374 ISL6323BCRZR5381 ISL6333BCRZ-T
ISL6334CRZ-T
ISL6366CRZ-TK
ISL6308CRZ-T
ISL6323BCRZ-T
ISL6333BIRZ
ISL6334CRZ-TS2568 ISL6366CRZ-TS2490
ISL6308CRZ-TR5372 ISL6323BCRZ-TR5381 ISL6333BIRZ-T
ISL6334CRZ-TS2701 ISL6366CRZ-TS2568
ISL6308CRZ-TR5374 ISL6323BCRZ-TS2709 ISL6333CCRZ
ISL6334DCRZ
ISL6366IRZ
ISL6308CRZ-TS2568 ISL6324ACRZ
ISL6333CCRZ-T
ISL6334DCRZ-T
ISL6366IRZ-T
ISL6308CRZ-TS2701 ISL6324ACRZR5381 ISL6333CIRZ
ISL6334DIRZ
ISL6625ACRZ-T
ISL6308IRZ
ISL6324ACRZ-T
ISL6333CIRZ-T
ISL6334DIRZ-T
ISL6625AIRZ-T
ISL6308IRZ-T
ISL6324ACRZ-TR5381 ISL6333CRZ
ISL6334IRZ
ISL6308IRZ-TR5384 ISL6324ACRZ-TR5429 ISL6333CRZ-T
ISL6334IRZ-T
ISL6308IRZ-TS2568 ISL6326CRZ
ISL6333CRZ-TS2568 ISL6334IRZ-TS2705
This notice is to inform you that Intersil will begin using the Advanced Semiconductor
Engineering (ASECL) facility as alternate site for assembly of the listed DFN/QFN (Dual/Quad
Flat No-Lead) packaged products. This action will expand current capabilities and capacities
to optimize Intersil’s ability to meet customer’s delivery requirements. The product and site-
specific qualification activities are complete.
The Advanced Semiconductor Engineering (ASECL) facility is ISO 9001:2008 and ISO/TS
16949:2009 certified and qualified as a supplier to Intersil for assembly of packaged
products. There will be no change in the mold compound series, die attach, lead frame
material, wire type, package outline drawing (POD) or moisture sensitivity level (MSL).
The assembly qualification plan is designed using JEDEC and other applicable industry
standards to confirm there is no impact to form, fit, function, or interchangeability of the