ISL54066 Datasheet, PDF (2/14 Pages) Intersil Corporation – 1.8V to +6.5V, High Off-Isolation, Dual SPST Analog Switch

ISL54066
Pinouts (Note 1)
ISL54066
(10 LD TDFN)
TOP VIEW
CTL1 1
OUT1 2
GND1 3
IN1 4
GND3 5
200k
10k
200k
10 CTL2
9 OUT2
8 GND2
7 _IN2
10k
6 V+
OUT1 ₈
ISL54066
(10 LD µTQFN)
TOP VIEW
CTL1
CTL2
7
6
5 ^OUT2
GND1 ₉
IN1 10
200k
10k
10k
200k
1
2
GND3
V+
4 ^GND2
3 ^IN2
NOTE:
1. Switches Shown for CTLx = Logic “0”. Logic “0” ≤0.5V. Logic “1”
≥1.4V with a 3V supply.
Truth Table
CTLx
INx/OUTx
0
OPEN
1
CLOSED
NOTE: Logic “0” ≤0.5V. Logic “1” ≥1.4V with a 3V supply.
Pin Descriptions
PIN
FUNCTION
V+ System Power Supply Input (+1.8V to +6.5V)
GND1 10kΩ Input Shunt Ground
GND2 200kΩ Output Shunt Ground
GND3 IC Ground Connection
CTLx
INx
OUTx
Digital Control Input
Switch x Input
Switch x Output
Ordering Information
PART NUMBER
PART MARKING
TEMP. RANGE
(°C)
PACKAGE
(Pb-free)
PKG.
DWG. #
ISL54066IRZ
(Note 3)
4066
-40 to +85
10 Ld 3x3 TDFN
L10.3x3A
ISL54066IRZ-T
(Notes 2, 3)
4066
-40 to +85
10 Ld 3x3 TDFN (Tape and Reel)
L10.3x3A
ISL54066IRUZ-T
9
(Notes 2, 4)
-40 to +85
10 Ld µTQFN (Tape and Reel)
L10.1.8x1.4A
NOTES:
2. Please refer to TB347 for details on reel specifications.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-
020.
4. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu
plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products
are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2
FN6584.0
February 25, 2009