ISL21007_11 Datasheet, PDF (2/20 Pages) Intersil Corporation – Precision, Low Noise FGA™ Voltage References

Ordering Information
ISL21007
PART NUMBER
(Notes 1, 2, 3)
PART
MARKING
V_OUT OPTION
(V)
GRADE
TEMP. RANGE
(°C)
PACKAGE
(Pb-Free)
PKG. DWG. #
ISL21007BFB812Z 21007BF Z12
1.250
±0.5mV, 3ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007CFB812Z 21007CF Z12
1.250
±1.0mV, 5ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007DFB812Z 21007DF Z12
1.250
±2.0mV, 10ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007BFB820Z 21007BF Z20
2.048
±0.5mV, 3ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007CFB820Z 21007CF Z20
2.048
±1.0mV, 5ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007DFB820Z 21007DF Z20
2.048
±2.0mV, 10ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007BFB825Z 21007BF Z25
2.500
±0.5mV, 3ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007CFB825Z 21007CF Z25
2.500
±1.0mV, 5ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007DFB825Z 21007DF Z25
2.500
±2.0mV, 10ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007BFB830Z 21007BF Z30
3.000
±0.5mV, 3ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007CFB830Z 21007CF Z30
3.000
±1.0mV, 5ppm/°C
-40 to +125 8 Ld SOIC
M8.15
ISL21007DFB830Z 21007DF Z30
3.000
±2.0mV, 10ppm/°C
-40 to +125 8 Ld SOIC
M8.15
NOTES:
1. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte tin
plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free
products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
2. Add “-T*” suffix for tape and reel. Please refer to TB347 for details on reel specifications.
3. For Moisture Sensitivity Level (MSL), please see device information page for ISL21007. For more information on MSL please see techbrief TB363.
2
FN6326.8
July 14, 2011