HCTS32MS Datasheet, PDF (2/9 Pages) Intersil Corporation – Radiation Hardened Quad 2-Input OR Gate

Specifications HCTS32MS
Absolute Maximum Ratings
Reliability Information
Supply Voltage (VCC). . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 to +7.0V
Input Voltage Range, All Inputs . . . . . . . . . . . . .-0.5V to VCC +0.5V
DC Input Current, Any One Input . . . . . . . . . . . . . . . . . . . . . . . .±10mA
DC Drain Current, Any One Output. . . . . . . . . . . . . . . . . . . . . . .±25mA
(All Voltage Reference to the VSS Terminal)
Storage Temperature Range (TSTG) . . . . . . . . . . . -65^oC to +150^oC
Lead Temperature (Soldering 10sec) . . . . . . . . . . . . . . . . . . +265^oC
Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . . . . . . +175^oC
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Thermal Resistance
θ_JA
θ_JC
SBDIP Package. . . . . . . . . . . . . . . . . . . . 74^oC/W 24^oC/W
Ceramic Flatpack Package . . . . . . . . . . . 116^oC/W 30^oC/W
Maximum Package Power Dissipation at +125^oC Ambient
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.68W
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . . . . 0.43W
If device power exceeds package dissipation capability, provide heat
sinking or derate linearly at the following rate:
SBDIP Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.5mW/^oC
Ceramic Flatpack Package . . . . . . . . . . . . . . . . . . . . . . 8.6mW/^oC
CAUTION: As with all semiconductors, stress listed under “Absolute Maximum Ratings” may be applied to devices (one at a time) without resulting in permanent
damage. This is a stress rating only. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. The conditions listed
under “Electrical Performance Characteristics” are the only conditions recommended for satisfactory device operation..
Operating Conditions
Supply Voltage (VCC). . . . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Input Rise and Fall Times at VCC = 4.5V (TR, TF) . . . 100ns/V Max
Operating Temperature Range (T_A) . . . . . . . . . . . . -55^oC to +125^oC
Input Low Voltage (VIL). . . . . . . . . . . . . . . . . . . . . . . . . 0.0V to 0.8V
Input High Voltage (VIH) . . . . . . . . . . . . . . . . . . . . . . .VCC/2 to VCC
TABLE 1. DC ELECTRICAL PERFORMANCE CHARACTERISTICS
PARAMETER
Quiescent Current
SYMBOL
(NOTE 1)
CONDITIONS
ICC
VCC = 5.5V,
VIN = VCC or GND
Output Current
(Sink)
Output Current
(Source)
Output Voltage Low
Output Voltage High
Input Leakage
Current
IOL
IOH
VOL
VOH
IIN
VCC = 4.5V, VIH = 4.5V,
VOUT = 0.4V, VIL = 0V
(Note 3)
VCC = 4.5V, VIH = 4.5V,
VOUT = VCC -0.4V,
VIL = 0V (Note 3)
VCC = 4.5V, VIH = 2.25V,
IOL = 50µA, VIL = 0.8V
VCC = 5.5V, VIH = 2.75V,
IOL = 50µA, VIL = 0.8V
VCC = 4.5V, VIH = 2.25V,
IOH = -50µA, VIL = 0.8V
VCC = 5.5V, VIH = 2.75V,
IOH = -50µA, VIL = 0.8V
VCC = 5.5V, VIN = VCC or
GND
Noise Immunity
Functional Test
FN
VCC = 4.5V, VIH = 2.25V,
VIL = 0.8V (Note 2)
GROUP
A SUB-
GROUPS
1
2, 3
1
2, 3
1
2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1
2, 3
7, 8A, 8B
TEMPERATURE
+25^oC
+125^oC, -55^oC
+25^oC
+125^oC, -55^oC
+25^oC
+125^oC, -55^oC
+25^oC, +125^oC, -55^oC
+25^oC, +125^oC, -55^oC
+25^oC, +125^oC, -55^oC
+25^oC, +125^oC, -55^oC
+25^oC
+125^oC, -55^oC
+25^oC, +125^oC, -55^oC
NOTES:
1. All voltages reference to device GND.
2. For functional tests VO ≥ 4.0V is recognized as a logic “1”, and VO ≤ 0.5V is recognized as a logic “0”.
3. Force/Measure functions may be interchanged.
LIMITS
MIN MAX UNITS
-
10
µA
-
200
µA
4.8
-
mA
4.0
-
mA
-4.8
-
mA
-4.0
-
mA
-
0.1
V
-
0.1
V
VCC
-
V
-0.1
VCC
-
V
-0.1
-
±0.5
µA
-
±5.0
µA
-
-
-
Spec Number 518638
451