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ISL62881_10 Datasheet, PDF (19/35 Pages) Intersil Corporation – Single-Phase PWM Regulator for IMVP-6.5™ Mobile CPUs and GPUs
ISL62881, ISL62881B
iO
iL
VO
RING
BACK
FIGURE 17. OUTPUT VOLTAGE RING BACK PROBLEM
ISUM+
Rntcs
Rp
Rntc
Cn.1
Rn
OPTIONAL
+
Cn.2 Vcn
-
Ri ISUM-
Rip Cip
OPTIONAL
FIGURE 18. OPTIONAL CIRCUITS FOR RING BACK
REDUCTION
Figure 17 shows the output voltage ring back problem
during load transient response. The load current io has a
fast step change, but the inductor current iL cannot
accurately follow. Instead, iL responds in first order
system fashion due to the nature of current loop. The
ESR and ESL effect of the output capacitors makes the
output voltage Vo dip quickly upon load current change.
However, the controller regulates Vo according to the
droop current idroop, which is a real-time representation
of iL; therefore it pulls Vo back to the level dictated by iL,
causing the ring back problem. This phenomenon is not
observed when the output capacitors have very low ESR
and ESL, such as all ceramic capacitors.
Figure 18 shows two optional circuits for reduction of the
ring back. Rip and Cip form an R-C branch in parallel with
Ri, providing a lower impedance path than Ri at the
beginning of io change. Rip and Cip do not have any
effect at steady state. Through proper selection of Rip
and Cip values, idroop can resemble io rather than iL, and
Vo will not ring back. The recommended value for Rip is
100W. Cip should be determined through tuning the load
transient response waveforms on an actual board. The
recommended range for Cip is 100pF~2000pF.
Cn is the capacitor used to match the inductor time
constant. It usually takes the parallel of two (or more)
capacitors to get the desired value. Figure 18 shows
that two capacitors Cn.1 and Cn.2 are in parallel.
Resistor Rn is an optional component to reduce the Vo
ring back. At steady state, Cn.1 + Cn.2 provides the
desired Cn capacitance. At the beginning of io change,
the effective capacitance is less because Rn increases
the impedance of the Cn.1 branch. As Figure 15
explains, Vo tends to dip when Cn is too small, and this
effect will reduce the Vo ring back. This effect is more
pronounced when Cn.1 is much larger than Cn.2. It is
also more pronounced when Rn is bigger. However, the
presence of Rn increases the ripple of the Vn signal if
Cn.2 is too small. It is recommended to keep Cn.2
greater than 2200pF. Rn value usually is a few ohms.
Cn.1, Cn.2 and Rn values should be determined
through tuning the load transient response waveforms
on an actual board.
Rip and Cip form an R-C branch in parallel with Ri,
providing a lower impedance path than Ri at the
beginning of io change. Rip and Cip do not have any
effect at steady state. Through proper selection of Rip
and Cip values, idroop can resemble io rather than iL,
and Vo will not ring back. The recommended value for
Rip is 100Ω. Cip should be determined through tuning
the load transient response waveforms on an actual
board. The recommended range for Cip is
100pF~2000pF. However, it should be noted that the
Rip -Cip branch may distort the idroop waveform.
Instead of being triangular as the real inductor current,
idroop may have sharp spikes, which may adversely
affect idroop average value detection and therefore
may affect OCP accuracy. User discretion is advised.
Resistor Current-Sensing Network
PHASE
L
DCR
RSEN
RSUM
Vcn
ISUM+
Cn
Ri
ISUM-
Io
FIGURE 19. RESISTOR CURRENT-SENSING NETWORK
Figure 19 shows the resistor current-sensing network.
The inductor has a series current-sensing resistor Rsen.
Rsum and is connected to the Rsen pad to accurately
capture the inductor current information. The Rsum feeds
the sensed information to capacitor Cn. Rsum and Cn
19
FN6924.1
February 25, 2010