ISL54222A_10 Datasheet, PDF (18/19 Pages) Intersil Corporation – High-Speed USB 2.0 (480Mbps) Multiplexer

ISL54222A
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
D
6
INDEX AREA _N
2X 0.10C
12
2X 0.10C
TOP VIEW
AB
E
0.10C
C
0.05C
A
SEATING PLANE
A1
SIDE VIEW
(DATUM A)
PIN #1 ID _{1 2}
NX L
4xk
N
(DATUM B)
N-1
e
NX b 5
0.10 MC A B
0.05 MC
3
(ND-1) X e
BOTTOM VIEW
NX (b)
5
(A1)
SECTION "C-C"
CL
L
e
CC
TERMINAL TIP
FOR ODD TERMINAL/SIDE
b
0.05 MIN
L
L10.2.1x1.6A
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
MILLIMETERS
SYMBOL
MIN
NOMI-
NAL
MAX
NOTES
A
0.45
0.50
0.55
-
A1
-
-
0.05
-
A3
0.127 REF
-
b
0.15
0.20
0.25
5
D
2.05
2.10
2.15
-
E
1.55
1.60
1.65
-
e
0.50 BSC
-
k
0.20
-
-
-
L
0.35
0.40
0.45
-
N
10
2
Nd
4
3
Ne
1
3
θ
0
-
12
4
NOTES:
Rev. 3 6/06
1. Dimensioning and tolerancing conform to ASME Y14.5-
1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on D and E
side, respectively.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is
measured between 0.15mm and 0.30mm from the
terminal tip.
6. The configuration of the pin #1 identifier is optional, but
must be located within the zone indicated. The pin #1
identifier may be either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. Same as JEDEC MO-255UABD except:
No lead-pull-back, "A" MIN dimension = 0.45 not
0.50mm
"L" MAX dimension = 0.45 not 0.42mm.
10. For additional information, to assist with the PCB Land
Pattern Design effort, see Intersil Technical Brief TB389.
2.50
1.75
0.10 MIN
DETAIL “A” PIN 1 ID
0.275
2.00
0.80
0.25
0.50
LAND PATTERN10
18
FN6902.1
February 4, 2010