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ICL3224E Datasheet, PDF (18/19 Pages) Intersil Corporation – 15kV ESD Protected, +3V to +5.5V, 1Microamp, 250kbps, RS-232 Transceivers with Enhanced Automatic Powerdown | |||
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ICL3224E, ICL3226E, ICL3244E
Shrink Small Outline Plastic Packages (SSOP)
N
INDEX
AREA
H
E
-B-
0.25(0.010) M B M
GAUGE
PLANE
123
-A-
D
SEATING PLANE
A
L
0.25
0.010
-C-
µα
e
A1
A2
C
B
0.10(0.004)
0.25(0.010) M C A M B S
NOTES:
1. Symbols are defined in the âMO Series Symbol Listâ in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension âDâ does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension âEâ does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch)
per side.
5. The chamfer on the body is optional. If it is not present, a visual in-
dex feature must be located within the crosshatched area.
6. âLâ is the length of terminal for soldering to a substrate.
7. âNâ is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension âBâ does not include dambar protrusion. Allowable dam-
bar protrusion shall be 0.13mm (0.005 inch) total in excess of âBâ
dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
-
A2
0.065 0.072 1.65
1.85
-
B
0.009 0.014 0.22
0.38
9
C
0.004 0.009 0.09
0.25
-
D
0.390 0.413 9.90 10.50
3
E
0.197 0.220 5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292 0.322 7.40
8.20
-
L
0.022 0.037 0.55
0.95
6
N
28
28
7
α
0o
8o
0o
8o
-
Rev. 1 3/95
18
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