ISL54220 Datasheet, PDF (16/18 Pages) Intersil Corporation – High-Speed USB 2.0 (480Mbps) Multiplexer

ISL54220
Package Outline Drawing
L10.1.8x1.4A
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 4, 9/09
1.80
6
INDEX AREA
2X 0.10 C
2X 0.10 C
12
TOP VIEW
AB
(DATUM A)
PIN #1 ID
0.50
NX 0.40
12
NX 0.20 5
10X
0.10 M C A B
0.05 M C
5 ^{(DATUM B)}
7
0.40 BSC
BOTTOM VIEW
2.20
1.00
1.00
0.60
0.10 C
C
0.05 C
0.5
SEATING PLANE
0.05 MAX
SIDE VIEW
0.50
1.80
0.40
0.20
0.20
0.40
10 _{LAND PATTERN}
TYPICAL RECOMMENDED LAND PATTERN
5
NX (0.20)
(0.05 MAX)
C_L
0.127 REF
0.40
SECTION "C-C"
e
CC
0.40 BSC
DETAIL "X"
TERMINAL TIP
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals. Total 10 leads.
3. Nd and Ne refer to the number of terminals on D (4) and E (6) side,
respectively.
4. All dimensions are in millimeters. Tolerances ±0.05mm unless
otherwise noted. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. JEDEC Reference MO-255.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
16
FN6819.1
February 4, 2010