ISL58327 Datasheet, PDF (15/15 Pages) Intersil Corporation – Wide Optical Spectrum Laser Power Monitor IC

ISL58327
Package Outline Drawing
S3x3.9
3X3 ARRAY 9 BUMP OPTICAL CHIP SCALE PACKAGE (OCSP)
Rev 7, 10/10
2.155 ±0.025
A1
CORNER
A
B
2.155 ±0.025
TOP VIEW
1.30
3
2
1
A
B
C
A1
CORNER
0.65
1.30
0.30 ±0.03 ₅
0.15 M C A B
0.65
0.08 M C
BOTTOM VIEW
1.045 MAX
0.825 ±0.045
0.16 ±0.03
SIDE VIEW
0.10 C
SEATING PLANE
C
0.10 C
(1.30)
(0.65)
(1.30)
(0.30)
(0.65)
TYPICAL RECOMMENDED LAND PATTERN
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference only.
2. Dimensioning and tolerancing conform to ASME Y 14.5M-1994
3. Primary datum C and seating plane are defined by the spherical
crowns of the contact balls.
4. Pin "A1" is marked on the top and bottom side adjacent to the
A1 ball.
5. Dimension is measured at the maximum ball diameter.
15
FN6577.2
July 29, 2013