ISL28191_08 Datasheet, PDF (15/16 Pages) Intersil Corporation – Single and Dual Single Supply Ultra-Low Noise, Low Distortion Rail-to-Rail Output, Op Amp

ISL28191, ISL28291
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
D
6
INDEX AREA _N
2X 0.10 C
2X 0.10 C
12
TOP VIEW
AB
E
0.10 C
C
0.05 C
A
SEATING PLANE
A1
SIDE VIEW
(DATUM A)
PIN #1 ID
L1
NX L
12
NX b 5
10X
0.10 M C A B
0.05 M C
5 ^{(DATUM B)}
7
e
BOTTOM VIEW
NX (b)
(A1)
5
SECTION "C-C"
CL
e
CC
L
TERMINAL TIP
L10.1.8x1.4A
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC
PACKAGE
MILLIMETERS
SYMBOL
MIN
NOMINAL MAX
NOTES
A
0.45
0.50
0.55
-
A1
-
-
0.05
-
A3
0.127 REF
-
b
0.15
0.20
0.25
5
D
1.75
1.80
1.85
-
E
1.35
1.40
1.45
-
e
0.40 BSC
-
L
0.35
0.40
0.45
-
L1
0.45
0.50
0.55
-
N
10
2
Nd
2
3
Ne
3
3
θ
0
-
12
4
NOTES:
Rev. 3 6/06
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on D and E side,
respectively.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. JEDEC Reference MO-255.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
2.20
1.00
1.00
0.60
0.50
1.80
0.40
0.20
0.20
0.40
10 _{LAND PATTERN}
15
FN6156.5
February 20, 2008