ISL76683_1103 Datasheet, PDF (14/17 Pages) Intersil Corporation – Light-to-Digital Output Sensor

ISL76683
D_LENS
D₂ >1.5mm
LIGHT PIPE
t
L
D₂
D_LENS
ISL76683
FIGURE 16. WINDOW WITH LIGHT GUIDE/PIPE
1
2.00mm
2
0.29mm
3
2.10mm
6
5
0.56mm
4
0.46mm
FIGURE 17. SENSOR LOCATION DRAWING
Suggested PCB Footprint
Footprint pads should be a nominal 1-to-1 correspondence with
package pads. Since ambient light sensor devices do not
dissipate high power, heat dissipation through the exposed pad is
not important; instead, similar to DFN or QFN, the exposed pad
provides robustness in board mount process. Intersil
recommends mounting the exposed pad to the PCB, but this is
not mandatory.
Layout Considerations
The ISL76683 is relatively insensitive to layout. Like other I²C
devices, it is intended to provide excellent performance even in
significantly noisy environments. There are only a few
considerations that will ensure best performance.
Route the supply and I²C traces as far as possible from all
sources of noise. Use two power-supply decoupling capacitors,
4.7µF and 0.1µF, placed close to the device.
Typical Circuit
A typical application for the ISL76683 is shown in Figure 18. The
ISL76683’s I²C address is internally hardwired as 1000100. The
device can be tied onto a system’s I²C bus together with other
I²C compliant devices.
Soldering Considerations
Convection heating is recommended for reflow soldering; direct
infrared heating is not recommended. The plastic ODFN package
does not require a custom reflow soldering profile, and is
qualified to +260°C. A standard reflow soldering profile with a
+260°C maximum is recommended.
14
FN7697.2
March 17, 2011