HA5013_04 Datasheet, PDF (14/14 Pages) Intersil Corporation – Triple, 125MHz Video Amplifier

Die Characteristics
DIE DIMENSIONS:
2010µm x 3130µm x 483µm
METALLIZATION:
Type: Metal 1: AlCu (1%)
Thickness: Metal 1: 8kÅ ±0.4kÅ
Type: Metal 2: AlCu (1%)
Thickness: Metal 2: 16kÅ ±0.8kÅ
SUBSTRATE POTENTIAL
Unbiased
Metallization Mask Layout
NC
HA5013
PASSIVATION:
Type: Nitride
Thickness: 4kÅ ±0.4kÅ
TRANSISTOR COUNT:
248
PROCESS:
High Frequency Bipolar Dielectric Isolation
HA5013
NC
OUT2
-IN2
NC
+IN2
V+
V-
+IN1
+IN3
-IN1
OUT1
OUT3
-IN3
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
14