ISL28138 Datasheet, PDF (13/16 Pages) Intersil Corporation – 4.5MHz, Single and Dual Precision Rail-to-Rail Input-Output (RRIO) Op Amps with Very Low Input Bias Current

ISL28138, ISL28238
Proper Layout Maximizes Performance
To achieve the maximum performance of the high input
impedance and low offset voltage, care should be taken in
the circuit board layout. The PC board surface must remain
clean and free of moisture to avoid leakage currents
between adjacent traces. Surface coating of the circuit board
will reduce surface moisture and provide a humidity barrier,
reducing parasitic resistance on the board. When input
leakage current is a concern, the use of guard rings around
the amplifier inputs will further reduce leakage currents.
Figure 44 shows a guard ring example for a unity gain
amplifier that uses the low impedance amplifier output at the
same voltage as the high impedance input to eliminate
surface leakage. The guard ring does not need to be a
specific width, but it should form a continuous loop around
both inputs. For further reduction of leakage currents,
components can be mounted to the PC board using Teflon
standoff insulators.
HIGH IMPEDANCE INPUT
V+
IN
FIGURE 44. GUARD RING EXAMPLE FOR UNITY GAIN
AMPLIFIER
Current Limiting
The ISL28138 and ISL28238 have no internal current
limiting circuitry. If the output is shorted, it is possible to
exceed the Absolute Maximum Rating for output current or
power dissipation, potentially resulting in the destruction of
the device.
Power Dissipation
It is possible to exceed the +150°C maximum junction
temperatures under certain load and power-supply
conditions. It is therefore important to calculate the
maximum junction temperature (T_JMAX) for all applications
to determine if power supply voltages, load conditions, or
package type need to be modified to remain in the safe
operating area. These parameters are related in Equation 1:
T_JMAX = T_MAX + (θ_JAxPD_MAXTOTAL)
(EQ. 1)
where:
• P_DMAXTOTAL is the sum of the maximum power
dissipation of each amplifier in the package (PD_MAX)
• PD_MAX for each amplifier can be calculated as shown in
Equation 2:
PD_MAX
=
2*V_S × I_SMAX + (V_S
-
V_OUTMAX
)
×
V_{-----O----U----T----M-----A----X--}
R_{L (EQ.}
2)
where:
• T_MAX = Maximum ambient temperature
• θ_JA = Thermal resistance of the package
• PD_MAX = Maximum power dissipation of 1 amplifier
• V_S = Supply voltage (Magnitude of V₊ and V_-)
• I_MAX = Maximum supply current of 1 amplifier
• V_OUTMAX = Maximum output voltage swing of the
application
• R_L = Load resistance
13
FN6336.2
February 19, 2008