ISL76322_15 Datasheet, PDF (12/14 Pages) Intersil Corporation – 16-Bit Long-Reach Video Automotive Grade SERDES

ISL76322
Exposed Pad
While it is not a required electrical connection, it is
recommended that the exposed pad on the bottom of the
package be soldered to the circuit board. This will ensure that the
full power dissipation of the package can be utilized. The pad
should be connected to ground and not left floating. For best
thermal conductivity, 16 vias should connect the footprint for the
exposed pad on the circuit board to the ground plane. This
connection is not required for basic operation of the chip.
COPPER PAD
VIAS
16x
FIGURE 6. LAYOUT FOR THE EXPOSED PAD
For additional products, see www.intersil.com/en/products.html
Intersil Automotive Qualified products are manufactured, assembled and tested utilizing TS16949 quality systems as noted
in the quality certifications found at www.intersil.com/en/support/qualandreliability.html
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time
without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be
accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
Submit Document Feedback 12
May 6, 2015
FN7611.3