ISL54409 Datasheet, PDF (12/13 Pages) Intersil Corporation – Audio/USB 2.0 Wired-OR Switch with Click and Pop Reduction

ISL54409, ISL54410
Ultra Thin Quad Flat No-Lead Plastic Package (UTQFN)
D
AB
6
INDEX AREA _N
E
2X 0.10C
2X 0.10C
12
TOP VIEW
0.10C
C
0.05C
A
SEATING PLANE
A1
SIDE VIEW
(DATUM A)
PIN #1 ID
NX L
12
L1
NX b 5
10X
0.10 MC A B
0.05 MC
5 ^{(DATUM B)}
7
e
BOTTOM VIEW
NX (b)
5
(A1)
SECTION "C-C"
CL
e
CC
L
TERMINAL TIP
2.20
1.00
1.00
0.60
L10.1.8x1.4A
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
MILLIMETERS
SYMBOL
MIN
NOMI-
NAL
MAX
NOTES
A
0.45
0.50
0.55
-
A1
-
-
0.05
-
A3
0.127 REF
-
b
0.15
0.20
0.25
5
D
1.75
1.80
1.85
-
E
1.35
1.40
1.45
-
e
0.40 BSC
-
L
0.35
0.40
0.45
-
L1
0.45
0.50
0.55
-
N
10
2
Nd
2
3
Ne
3
3
θ
0
-
12
4
NOTES:
Rev. 3 6/06
1. Dimensioning and tolerancing conform to ASME Y14.5-
1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on D and E
side, respectively.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is
measured between 0.15mm and 0.30mm from the
terminal tip.
6. The configuration of the pin #1 identifier is optional, but
must be located within the zone indicated. The pin #1
identifier may be either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. JEDEC Reference MO-255.
10. For additional information, to assist with the PCB Land
Pattern Design effort, see Intersil Technical Brief TB389.
0.50
1.80
0.40
0.20
0.20
0.40
10 _{LAND PATTERN}
12
FN6983.0
September 25, 2009