ISL29043_14 Datasheet, PDF (12/16 Pages) Intersil Corporation – Low Power Ambient Light and Proximity Sensor with Internal IR-LED and Digital Output

ISL29043
FIGURE 7. EXAMPLE LIGHT BAFFLE DESIGN
250
NO BAFFLE, 0.1mm FROM GLASS
200
AGAINST GLASS, NO BAFFLE
150
100
NO COVER GLASS
GLASS W/ BAFFLE
50
0
0 10 20 30 40 50 60 70 80 90
DISTANCE (mm)
FIGURE 8. PROXIMITY COMPARISON WITHOUT LIGHT BAFFLE
(IRDR = 110mA)
Typical Circuit
A typical application for the ISL29043 is shown in Figure 9. The
ISL29043’s I²C address is internally hardwired as 0b100010<x>,
with x representing the logic state of input I²C address pin
ADDR0. The device can be tied onto a system’s I²C bus together
with other I²C compliant devices.
Soldering Considerations
Convection heating is recommended for reflow soldering;
direct-infrared heating is not recommended. The plastic ODFN
package requires a custom reflow soldering profile pursuant to
Figure 4 in TB489 (Surface Mount Assembly Guidelines for
Optical Dual Flat No Lead (ODFN) Co-Packages).
Suggested PCB Footprint
It is important that users check the “Surface Mount Assembly
Guidelines for Optical Dual FlatPack No Lead (ODFN) Package”
before starting ODFN product board mounting. However, this
device requires a special solder reflow profile as mentioned in
Figure 4 in TB489 (Surface Mount Guidelines for Optical
Co-packages).
http://www.intersil.com/data/tb/TB489.pdf
Layout Considerations
The ISL29043 is relatively insensitive to layout. Like other I²C
devices, it is intended to provide excellent performance even in
significantly noisy environments. There are only a few
considerations that will ensure best performance.
Route the supply and I²C traces as far as possible from all
sources of noise. 0.1µF and 1µF power supply decoupling
capacitors need to be placed close to the device.
12
FN7935.0
February 9, 2012