ISL29030_14 Datasheet, PDF (12/17 Pages) Intersil Corporation – Low Power Ambient Light and Proximity Sensor with Intelligent Interrupt and Sleep Modes - Analog and Digita Out

ISL29030
Soldering Considerations
Convection heating is recommended for reflow soldering; direct-
infrared heating is not recommended. The plastic ODFN package
does not require a custom reflow soldering profile, and is qualified to
+260°C. A standard reflow soldering profile with a +260°C
maximum is recommended.
(http://www.intersil.com/data/tb/TB477.pdf)
Suggested PCB Footprint
It is important that users check the “Surface Mount Assembly
Guidelines for Optical Dual FlatPack No Lead (ODFN) Package”
before starting ODFN product board mounting.
(http://www.intersil.com/data/tb/TB477.pdf)
Layout Considerations
The ISL29030 is relatively insensitive to layout. Like other I²C
devices, it is intended to provide excellent performance even in
significantly noisy environments. There are only a few
considerations that will ensure best performance.
Route the supply and I²C traces as far as possible from all sources of
noise. A 0.1µF and 1µF power supply decoupling capacitors need to be
placed close to the device.
V_DD
R1
10kΩ
R2
R3
10kΩ 10kΩ
V_IR-LED
V_{I2C_PULL-UP}
I²C MASTER
MICROCONTROLLER
INT
SDA
SCL
V
SLAVE_0
1 _IALS
3.5kΩ
IRDR ⁸
C1
C2
1µF
0.1µF
2 _VDD
3 _GND
7
INT
SDA ⁶
4
5
REXT SCL
REXT ISL29030
499kΩ
SLAVE_1
SDA
SCL
I²C SLAVE_n
SDA
SCL
FIGURE 5. ISL29030 TYPICAL CIRCUIT
12
FN6872.1
November 12, 2012