ISL54051_14 Datasheet, PDF (11/12 Pages) Intersil Corporation – Ultra Low ON-Resistance, Low Voltage, Single Supply, Single SPST Analog Switches

ISL54051, ISL54052
Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)
E
AB
PIN 1
D
REFERENCE
2X 0.10 C
2X 0.10 C
TOP VIEW
0.10 C
7X 0.08 C
DETAIL A
A
A1 A3
SIDE VIEW
C
SEATING
PLANE
DETAIL B
1
L1
4X
e
5X
3
L
6
4
BOTTOM VIEW
b 6X
0.10 C A B
0.05 C NOTE 3
0.1x45°
CHAMFER
A1
A3
DETAIL A
DETAIL B PIN 1 LEAD
L6.1.2x1.0A
6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
MILLIMETERS
SYMBOL
MIN NOMINAL MAX
NOTES
A
0.45
0.50
0.55
-
A1
-
-
0.05
-
A3
0.127 REF
-
b
0.15
0.20
0.25
5
D
0.95
1.00
1.05
-
E
1.15
1.20
1.25
-
e
0.40 BSC
-
L
0.30
0.35
0.40
-
L1
0.40
0.45
0.50
-
N
6
2
Ne
3
3
θ
0
-
12
4
NOTES:
Rev. 2 8/06
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Ne refers to the number of terminals on E side.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Maximum package warpage is 0.05mm.
8. Maximum allowable burrs is 0.076mm in all directions.
9. JEDEC Reference MO-255.
10. For additional information, to assist with the PCB Land Pattern
Design effort, see Intersil Technical Brief TB389.
1.00
1.40
0.20
0.45
0.30
0.35
0.20
0.40
LAND PATTERN 10
11
FN6459.3
October 19, 2009