ISL24021_15 Datasheet, PDF (11/13 Pages) Intersil Corporation – 1A Rail-to-Rail Input-Output Operational Amplifier

ISL24021
JEDEC JESD51-7 HIGH EFFECTIVE THERMAL
CONDUCTIVITY (4-LAYER) TEST BOARD - TDFN
EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5
3.0
2.5W
2.5
2.0
TDFN8
θ_JA = +50 (°C/W)
1.5
1.0
0.5
0
0
25
50
75
100
125
150
AMBIENT TEMP (°C)
FIGURE 28. PACKAGE POWER DISSIPATION vs AMBIENT
TEMPERATURE
Printed Circuit Board Layout
As with any high-frequency device, good printed circuit board
layout is necessary for optimum performance. For the ISL24021
low impedance analog power and ground planes are
recommended, and trace lengths should be as short as possible.
The power supply pins must be well bypassed to reduce the risk
of oscillation. For optimal thermal and operating performance
the ISL24021 thermal pad should always be connected to the
lowest potential, V_SS.
For normal single supply operation (the V_SS pin is connected to
GND) a 4.7µF capacitor should be placed from V_DD to GND, then
a parallel 0.1µF capacitor should be connected as close to the
amplifier as possible. For dual supply operation the same
bypassing techniques should be utilized by connecting capacitors
from each supply to GND.
11
FN6637.1
October 18, 2011