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| HI-201HS Datasheet, PDF (11/11 Pages) Intersil Corporation – High Speed, Quad SPST, CMOS Analog Switch | |||
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Die Characteristics
DIE DIMENSIONS:
2440µm x 2860µm x 485µm
METALLIZATION:
Type: CuAl
Thickness: 16kÃ
±2kÃ
Metallization Mask Layout
A1
OUT1
HI-201HS
PASSIVATION:
Type: Nitride Over Silox
Nitride Thickness: 3.5kÃ
±1kÃ
Silox Thickness: 12kÃ
±2kÃ
WORST CASE CURRENT DENSITY:
9.5 x 104 A/cm2
HI-201HS
A2
OUT2
IN1
IN2
V-
V+
GND
IN4
IN3
OUT4
A4
OUT3
A3
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Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
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