82C52 Datasheet, PDF (11/20 Pages) Intersil Corporation – CMOS Serial Controller Interface

82C52
Absolute Maximum Ratings
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +8.0V
Input, Output or I/O Voltage . . . . . . . . . . . . GND-0.5V to V_CC +0.5V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 1
Operating Conditions
Operating Voltage Range . . . . . . . . . . . . . . . . . . . . . +4.5V to +5.5V
Operating Temperature Range
C82C52 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
I82C52 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
M82C52 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55°C to +125°C
Thermal Information
Thermal Resistance (Typical, Note 1)
θ_JA (°C/W) θ_JC (°C/W)
CERDIP Package . . . . . . . . . . . . . . . .
45
8.4
CLCC Package . . . . . . . . . . . . . . . . . .
60
14
PDIP Package . . . . . . . . . . . . . . . . . . .
55
N/A
PLCC Package . . . . . . . . . . . . . . . . . .
46
N/A
Maximum Junction Temperature
Ceramic Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +175°C
Plastic Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . -65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
(Lead Tips Only For Surface Mount Packages)
Die Characteristics
Gate Count . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1500 Gates
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θ_JA is measured with the component mounted on an evaluation PC board in free air.
DC Electrical Specifications V_CC = 5.0V ±10%, T_A = 0°C to +70°C (C82C52), T_A = -40°C to +85°C (l82C52)
T_A = -55°C to +125°C (M82C52)
SYMBOL
PARAMETER
MIN
MAX
UNITS
TEST CONDITIONS
V_IH
Logical One Input Voltage
2.0
-
2.2
-
V
I82C52, C82C52
V
M82C52
V_IL
Logical Zero Input Voltage
-
0.8
V
VTH
Schmitt Trigger Logic One Input Voltage V_CC -0.5
-
V
Reset Input
VTL
Schmitt Trigger Logic Zero Input Voltage
-
GND +0.5
V
Reset Input
VIH (CLK) Logical One Clock Input Voltage
VlL (CLK) Logical Zero Clock Input Voltage
V_CC -0.5
-
V
External Clock
-
GND +0.5
V
External Clock
VOH
Output High Voltage
VOL
II
Output Low Voltage
Input Leakage Current
3.0
V_CC -0.4
-
-1.0
-
-
0.4
+1.0
V
I_OH = -2.5mA, Except OX
V
I_OH = -100µA, For OX - I_OH = -1.0mA
V
l_OL = +2.5mA
µA
V_IN = GND or V_CC, DIP Pins 1, 2, 11, 12, 17,
18, 23, 25, 28
IO
ICCOP
Input/Output Leakage Current
Operating Power Supply Current
(Note 1)
-10.0
-
+10.0
4
µA
V_O = GND or V_CC, DIP Pins 3-10
mA
External Clock F = 2.4576MHz,
V_CC = 5.5V, V_IN = V_CC or GND,
Outputs Open
ICCSB Standby Supply Current
-
100
µA
V_CC = 5.5V, V_IN = V_CC or GND,
Outputs Open
NOTE:
1. Guaranteed and sampled, but not 100% tested. ICCOP is typically ≤ 1.5mA/MHz.
Capacitance T_A = 25°C
SYMBOL
PARAMETER
CIN Input Capacitance
COUT Output Capacitance
CI/O I/O Capacitance
11
TYPICAL
12
15
15
UNITS
pF
pF
pF
TEST CONDITIONS
FREQ = 1MHz, all measurements are
referenced to device GND
FN2950.3
April 26, 2006