HCTS541MS Datasheet, PDF (10/10 Pages) Intersil Corporation – Radiation Hardened Non-Inverting Octal Buffer/Line Driver, Three-State

Die Characteristics
DIE DIMENSIONS:
101 x 85 mils
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS541MS
HCTS541MS
A1 (3)
A2 (4)
A3 (5)
A4 (6)
A5 (7)
A6 (8)
(18) Y0
(17) Y1
(16) Y2
(15) Y3
(14) Y4
(13) Y5
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS541 is TA14456A.
Spec Number 518630
691