HCTS365MS Datasheet, PDF (10/10 Pages) Intersil Corporation – Radiation Hardened Hex Buffer/Line Driver Non-Inverting

HCTS365MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
Y1
A1
(3)
(2)
HCTS365MS
OE1
(1)
VCC
(16)
OE2
(15)
A2 (4)
Y2 (5)
NC
A3 (6)
NC
(14) A6
(13) Y6
(12) A5
(11) Y5
NC
(7)
Y3
(8)
NC
GND
(9)
(10)
Y4
A4
NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS365 is TA14413A.
Spec Number 518637
10