HCTS240AMS Datasheet, PDF (10/10 Pages) Intersil Corporation – Radiation Hardened Octal Buffer/Line Driver, Three-State

Die Characteristics
DIE DIMENSIONS:
106mils x 108mils
2.68mm x 2.74mm
METALLIZATION:
Type: SiAl
Metal Thickness: 11kÅ ± 1kÅ
GLASSIVATION:
Type: SiO₂
Thickness: 13kÅ ± 2.6kÅ
WORST CASE CURRENT DENSITY:
<2.0 x 10⁵A/cm²
BOND PAD SIZE:
100µm x 100µm
4 mils x 4 mils
Metallization Mask Layout
HCTS240AMS
HCTS240AMS
1 A1 (4)
2 Y2 (5)
1 A2 (6)
2 Y1 (7)
(18) 1 Y0
(17) 2 A3
(16) 1 Y1
(15) 2 A2
(14) 1 Y2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS240A is TA14400B.
Spec Number 518889
10