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HCTS191MS Datasheet, PDF (10/10 Pages) Intersil Corporation – Radiation Hardened Synchronous 4-Bit Up/Down Counter | |||
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Die Characteristics
DIE DIMENSIONS:
104 x 86 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11kÃ
± 1kÃ
GLASSIVATION:
Type: SiO2
Thickness: 13kÃ
± 2.6kÃ
WORST CASE CURRENT DENSITY:
< 2.0 x 105A/cm2
BOND PAD SIZE:
100µm x 100µm
4 x 4 mils
Metallization Mask Layout
HCTS191MS
HCTS191MS
Q1
P1
(2)
(1)
VCC
(16)
Q0 (3)
CE (4)
U/D (5)
Q2 (6)
(15) P0
(14) CP
(13) RC
(12) TC
Q3 (7)
(11) PL
(8)
(9)
(10)
GND
P3
P2
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS191 is TA14447A.
Spec Number 518621
589
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