EL9211_07 Datasheet, PDF (10/11 Pages) Intersil Corporation – 100MHz 100mA VCOM Amplifiers

EL9211, EL9212, EL9214
HTSSOP (Heat-Sink TSSOP) Family
0.25 M C A B
D
N
A
(N/2)+1
E E1
1
B
TOP VIEW
EXPOSED
THERMAL PAD
PIN #1 I.D.
(N/2)
0.20 C B A
2X
N/2 LEAD TIPS
D1
E2
BOTTOM VIEW
C
e
0.05
H
SEATING
PLANE
0.10 C
N LEADS
b
0.10 M C A B
SIDE VIEW
MDP0048
HTSSOP (HEAT-SINK TSSOP) FAMILY
MILLIMETERS
SYMBOL 14 LD 20 LD 24 LD 28 LD 38 LD TOLERANCE
A
1.20 1.20 1.20 1.20 1.20
Max
A1 0.075 0.075 0.075 0.075 0.075 ±0.075
A2
0.90 0.90 0.90 0.90 0.90 +0.15/-0.10
b
0.25 0.25 0.25 0.25 0.22 +0.05/-0.06
c
0.15 0.15 0.15 0.15 0.15 +0.05/-0.06
D
5.00 6.50 7.80 9.70 9.70
±0.10
D1
3.2 4.2 4.3 5.0 7.25 Reference
E
6.40 6.40 6.40 6.40 6.40
Basic
E1
4.40 4.40 4.40 4.40 4.40
±0.10
E2
3.0 3.0 3.0 3.0 3.0 Reference
e
0.65 0.65 0.65 0.65 0.50
Basic
L
0.60 0.60 0.60 0.60 0.60
±0.15
L1
1.00 1.00 1.00 1.00 1.00 Reference
N
14 20 24 28 38 Reference
NOTES:
Rev. 3 2/07
1. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
2. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
3. Dimensions “D” and “E1” are measured at Datum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
SEE DETAIL “X”
c
END VIEW
A ^A2
A1
L1
L
DETAIL X
GAUGE
PLANE
0.25
0° - 8°
10
FN7007.1
August 10, 2007