CD4017BMS Datasheet, PDF (10/10 Pages) Intersil Corporation – CMOS Counter/Dividers

CD4017BMS, CD4022BMS
Chip Dimensions and Pad Layouts
CD4017BMSH
Dimensions in parentheses are in millimeters
and are derived from the basic inch dimensions
as indicated. Grid graduations are in mils (10^-3 inch)
CD4022BMSH
METALLIZATION: Thickness: 11kÅ − 14kÅ, AL.
PASSIVATION: 10.4kÅ - 15.6kÅ, Silane
BOND PADS: 0.004 inches X 0.004 inches MIN
DIE THICKNESS: 0.0198 inches - 0.0218
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