Z5.067A Datasheet, PDF (1/1 Pages) Intersil Corporation – Plastic Packages for Integrated Circuits

Plastic Packages for Integrated Circuits
Single-In-Line Plastic Packages (SIP)
-A-
E
L2
A
0.006
-B- ^(0.15)
C2
D
-C-
L
PIN
#1
e
c
0^o- 8^o
b
0.010 (0.25) M B A M C M
L3
HEATSLUG
PLANE
0.00 - 0.0098
(0.00 - 0.25)
L1
0.004
(0.10)
0.450
E1
(11.43) _MIN
BACK VIEW
D1
0.609
(15.46)
MIN
0.350
(8.89)
MIN
0.043
(1.09)
TYP
e
LAND PATTERN
0.129
(3.27)
TYP
Z5.067A
5 LEAD PLASTIC SINGLE-IN-LINE PACKAGE SURFACE MOUNT
“GULLWING” LEAD FORM
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.170
0.180
4.32
4.57
-
C2
0.048
0.055
1.22
1.39
5
D
0.350
0.370
8.89
9.39
-
E
0.395
0.405 10.04
10.28
-
D1
0.310
-
7.88
-
-
E1
0.310
-
7.88
-
-
L
0.549
0.569 13.95
14.45
-
L1
0.068
0.088
1.72
2.24
-
L2
0.045
0.055
1.15
1.40
-
L3
0.030 BSC
0.76 BSC
4
b
0.028
0.037
0.71
0.94
5, 6, 7
c
0.018
0.024
0.46
0.60
5
e
0.067 BSC
1.70 BSC
-
NOTES:
Rev. 3 4/03
1. These package dimensions are within allowable dimensions of
JEDEC MO-169AB, Issue A.
2. Controlling dimension: Inch.
3. Dimensioning and tolerance per ANSI Y14.5M-1982.
4. Gauge plane L3 is parallel to heatslug plane.
5. Dimensions include lead finish.
6. Leads are not allowed above the datum -B- .
7. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed the
maximum “b” by more than 0.003’’ (0.08mm).
1