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ITF87072DK8T Datasheet, PDF (1/13 Pages) Intersil Corporation – 6A, 20V, 0.037 Ohm, Dual P-Channel, 2.5V Specified Power MOSFET
TM
Data Sheet
6A, 20V, 0.037 Ohm, Dual P-Channel,
2.5V Specified Power MOSFET
Packaging
SO8 (JEDEC MS-012AA)
BRANDING DASH
1
2
3
4
Symbol
SOURCE1(1)
GATE1(2)
SOURCE2(3)
GATE2(4)
5
DRAIN1(8)
DRAIN1(7)
DRAIN2(6)
DRAIN2(5)
ITF87072DK8T
March 2000 File Number 4812.3
Features
• Ultra Low On-Resistance
- rDS(ON) = 0.037Ω, VGS = −4.5V
- rDS(ON) = 0.039Ω, VGS = −4.0V
- rDS(ON) = 0.059Ω, VGS = −2.5V
• Gate to Source Protection Diode
• Simulation Models
- Temperature Compensated PSPICE™ and SABER
Electrical Models
- Spice and SABER Thermal Impedance Models
- www.intersil.com
• Peak Current vs Pulse Width Curve
• Transient Thermal Impedance Curve vs Board Mounting
Area
• Switching Time vs RGS Curve
Ordering Information
PART NUMBER
PACKAGE
BRAND
ITF87072DK8T
SO8
87072
NOTE: When ordering, use the entire part number. ITF87072DK8T
is available only in tape and reel.
Absolute Maximum Ratings TA = 25oC, Unless Otherwise Specified
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS
Drain Current
Continuous
Continuous
Continuous
Continuous
(TA
(TA
(TA
(TA
=
=
=
=
22115500oo00CCooCC,, VV,, VVGGGGSSSS====--44--..4250..VV05VV)) ))((NN((NNoottooeettee22))33))..
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ID
ID
ID
ID
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IDM
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TL
Package Body for 10s, See Technical Brief TB370 . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg
ITF87072DK8T
-20
-20
±12
6.0
6.0
1.5
1.5
Figure 4
2.5
20
-55 to 150
300
260
UNITS
V
V
V
A
A
A
A
W
mW/oC
oC
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. TJ = 25oC to 125oC.
2. 50oC/W measured using FR-4 board with 0.14 in2 (90.3 mm2) copper pad at 1 second.
3. 228oC/W measured using FR-4 board with 0.006 in2 (3.9 mm2) copper pad at 1000 second.
1
CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures.
SABER© is a Copyright of Analogy Inc. , PSPICE® is a registered trademark of MicroSim Corporation.
1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000