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ITF87008DQT Datasheet, PDF (1/13 Pages) Intersil Corporation – 7.0A, 20V, 0.023 Ohm, Dual N-Channel, 2.5V Specified Power MOSFET
Data Sheet
ITF87008DQT
March 2000 File Number 4814.2
7.0A, 20V, 0.023 Ohm, Dual N-Channel,
2.5V Specified Power MOSFET
Packaging
TSSOP-8
5
1
23 4
Symbol
DRAIN1(1)
SOURCE1(2)
SOURCE1(3)
GATE1(4)
(8) DRAIN2
(7) SOURCE2
(6) SOURCE2
(5) GATE2
Features
• Ultra Low On-Resistance
- rDS(ON) = 0.023Ω, VGS = 4.5V
- rDS(ON) = 0.024Ω, VGS = 4.0V
- rDS(ON) = 0.029Ω, VGS = 2.5V
• 2.5 Volt Gate Drive Capability
• Gate to Source Protection Diode
• Simulation Models
- Temperature Compensated PSPICE™ and SABER
Electrical Models
- Spice and SABER Thermal Impedance Models
- www.intersil.com
• Peak Current vs Pulse Width Curve
• Transient Thermal Impedance Curve vs Board Mounting
Area
• Switching Time vs RGS Curves
Ordering Information
PART NUMBER
PACKAGE
BRAND
ITF87008DQT
TSSOP-8
87008
NOTE: When ordering, use the entire part number. ITF87008DQT2
is available only in tape and reel.
Absolute Maximum Ratings TA = 25oC, Unless Otherwise Specified
ITF87008DQT
UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDSS
Drain to Gate Voltage (RGS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VDGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . VGS
Drain Current
Continuous
Continuous
Continuous
(TA
(TA
(TA
=
=
=
221550oo0CCoC,, VV, VGGGSSS===44..450.VV0V)) )((NN(Noottoeete22))3..)
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ID
ID
ID
Continuous (TA = 100oC, VGS = 2.5V) (Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ID
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .IDM
Power Dissipation (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . PD
Derate Above 25oC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . TJ, TSTG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .TL
Package Body for 10s, See Techbrief TB370 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Tpkg
NOTES:
1. TJ = 25oC to 125oC.
2. 62.5oC/W measured using FR-4 board with 0.50 in2 (322.6 mm2 ) copper pad at 1 second.
3. 230oC/W measured using FR-4 board with 0.0022 in2 (1.44 mm2) copper pad at 1000 seconds.
20
20
±12
7.0
7.0
2.0
2.0
Figure 4
2.0
16
-55 to 150
300
260
V
V
V
A
A
A
A
W
mW/oC
oC
oC
oC
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
1
CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures.
SABER© is a Copyright of Analogy Inc. PSPICE® is a registered trademark of MicroSim Corporation.
1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 2000