ITF86174SQT Datasheet, PDF (1/12 Pages) Intersil Corporation – 9A, 30V, 0.016 Ohm, P-Channel, Logic Level, Power MOSFET

Data Sheet
9A, 30V, 0.016 Ohm, P-Channel, Logic
Level, Power MOSFET
Packaging
TSSOP-8
5
1
23 ₄
Symbol
DRAIN(1)
SOURCE(2)
SOURCE(3)
GATE(4)
DRAIN(8)
SOURCE(7)
SOURCE(6)
DRAIN(5)
ITF86174SQT
March 2000 File Number 4799.3
Features
• Ultra Low On-Resistance
- r_DS(ON) = 0.016Ω, V_GS = −10V
- r_DS(ON) = 0.024Ω, V_GS = −4.5V
- r_DS(ON) = 0.027Ω, V_GS = −4V
• Gate to Source Protection Diode
• Simulation Models
- Temperature Compensated PSPICE™ and SABER
Electrical Models
- Spice and SABER Thermal Impedance Models
- www.intersil.com
• Peak Current vs Pulse Width Curve
• Transient Thermal Impedance Curve vs Board Mounting
Area
• Switching Time vs R_GS Curves
Ordering Information
PART NUMBER
PACKAGE
BRAND
ITF86174SQT
TSSOP-8
86174
NOTE: When ordering, use the entire part number. ITF86174SQT2
is available only in tape and reel.
Absolute Maximum Ratings T_A = 25^oC, Unless Otherwise Specified
ITF86174SQT
UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V_DSS
Drain to Gate Voltage (R_GS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V_DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V_GS
Drain Current
Continuous (T_A = 25^oC, V_GS = 10V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I_D
Continuous (T_A = 25^oC, V_GS = 4.5V) (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I_D
Continuous
Continuous
(T_A
(T_A
=
=
100^oC,
100^oC,
V_GS
V_GS
=
=
4.5V)
4.0V)
(Note
(Note
2)
2)
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I_D
I_D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I_DM
Power Dissipation (Note 2)
Derate Above 25^oC . . . .
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P_D
...
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T_J, T_STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T_L
Package Body for 10s, See Techbrief TB370 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T_pkg
NOTES:
1. T_J = 25^oC to 125^oC.
2. 62.5^oC/W measured using FR-4 board with 1.0in² (645.2mm²) copper pad at 10s.
-30
-30
±20
9.0
7.0
4.5
4.0
Figure 4
2.0
16
-55 to 150
300
260
V
V
V
A
A
A
A
W
mW/^oC
o_C
o_C
o_C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
1
CAUTION: These devices are sensitive to electrostatic discharge. Follow proper ESD Handling Procedures.
PSPICE® is a registered trademark of MicroSim Corporation.
SABER© is a Copyright of Analogy Inc. | 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 2000