ITF86130SK8T Datasheet, PDF (1/11 Pages) Intersil Corporation – 14A, 30V, 0.0078 Ohm, N-Channel, Logic Level, Power MOSFET

TM
Data Sheet
14A, 30V, 0.0078 Ohm, N-Channel, Logic
Level, Power MOSFET
Packaging
SO8 (JEDEC MS-012AA)
BRANDING DASH
1
2
3
4
Symbol
SOURCE(1)
SOURCE(2)
5
DRAIN(8)
DRAIN(7)
SOURCE(3)
GATE(4)
DRAIN(6)
DRAIN(5)
ITF86130SK8T
June 2000 File Number 4798.4
Features
• Ultra Low On-Resistance
- r_DS(ON) = 0.0078Ω, V_GS = 10V
- r_DS(ON) = 0.010Ω, V_GS = 4.5V
- r_DS(ON) = 0.012Ω, V_GS = 4.0V
• Gate to Source Protection Diode
• Simulation Models
- Temperature Compensated PSPICE™ and SABER
Electrical Models
- Spice and SABER Thermal Impedance Models
- www.intersil.com
• Peak Current vs Pulse Width Curve
• Transient Thermal Impedance Curve vs Board Mounting
Area
• Switching Time vs R_GS Curves
Ordering Information
PART NUMBER
PACKAGE
BRAND
ITF86130SK8T
SO8
86130
NOTE: When ordering, use the entire part number. ITF86130SK8T
is available only in tape and reel.
Absolute Maximum Ratings T_A = 25^oC, Unless Otherwise Specified
ITF86130SK8T
UNITS
Drain to Source Voltage (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V_DSS
Drain to Gate Voltage (R_GS = 20kΩ) (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V_DGR
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V_GS
Drain Current
Continuous
Continuous
(T_A=
(T_A=
25^oC,
25^oC,
V_GS
V_GS
=
=
10V) (Figure 2) (Note 2)
4.5V) (Note 2) . . . . . . . .
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I_D
I_D
Continuous
Continuous
(T_A=
(T_A=
100^oC,
100^oC,
V_GS
V_GS
=
=
4.5V)
4.0V)
(Note
(Note
2)
2)
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I_D
I_D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I_DM
Power Dissipation (Note 2)
Derate Above 25^oC . . . .
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P_D
...
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T_J, T_STG
Maximum Temperature for Soldering
Leads at 0.063in (1.6mm) from Case for 10s. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .T_L
Package Body for 10s, See Tech brief TB370 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T_pkg
NOTES:
1. T_J = 25^oC to 125^oC.
2. 50^oC/W measured using FR-4 board with 0.76in² (490.3mm²) copper pad at 10s.
30
30
±20
14.0
12.0
7.0
7.0
Figure 4
2.5
20
-55 to 150
300
260
V
V
V
A
A
A
A
A
W
mW/^oC
o_C
o_C
o_C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper ESD Handling Procedures.
PSPICE® is a registered trademark of MicroSim Corporation.
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