ISL99203 Datasheet, PDF (1/17 Pages) Intersil Corporation – High Efficiency Audio Subsystem

High Efficiency Audio Subsystem
ISL99203
The ISL99203 is a fully integrated high efficiency class-D
mono amplifier combined with a capfree headphone
amplifier. It is designed to maximize performance for
mobile phone applications while saving valuable board
space. The application circuit requires a minimum
requirement of external components and operates from a
2.4V to 5.5V input supply.
It is capable of delivering 1.5W of continuous output
power with less than 10% THD+N driving a 8Ω load
from a 5V supply. The speaker amplifier of the
ISL99203 features a high-efficiency, low-noise
modulation scheme. It operates with 85% efficiency at
400mW into 8Ω from 5V supply and has a
signal-to-noise ratio (SNR) that is greater than 95dB.
The architecture of the device allows it to achieve very
low level pop and click. This minimizes voltage glitches
at the output during turn-on and turn-off, thus reducing
audible noise on activation and deactivation. EMI
suppression is achieved by SRC (Slew Rate Control).
The amplifier passes FCC Radiated Emissions Standards
with 24 inches of Cable and achieves greater than 20dB
margin under FCC limits.
The class-D amplifier is designed to operate without a
low pass output filer thus saving cost and board space.
The headphone amplifier is a GND-reference capfree
amplifier. It can output up to 35mW into 32Ω at 3.3V.
Features
• Operating Voltage 2.4V to 5.5V
• Low Quiescent Current
• Low Shutdown Current
• Low RFI Susceptibility
• Integrated Bypass Switch, I²C Controlled
• I²C Control Interface
• 40 Step Digital Volume Control
• 3 Independent Volume Channels
• 10 Distinct Output Modes
• Speaker Amp Class-D
• Protection for UV/TSD/OC
• Independent Gain Boost for Headphone and Speaker
• All Digital Interfaces 1.8V Compatible
• Exposed Pad at Ground Voltage
Applications*(see page 16)
• Mobile Phones
• PDAs
• Portable Media Players
• Portable Gaming
Ordering Information
PART
TEMP
NUMBER
PART RANGE
(Notes 1, 2, 3) MARKING (°C)
PACKAGE PKG.
(Pb-free) DWG. #
ISL99203IIZ-T 203
-40 to +85 20 Ball WLCSP W4x5.20
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free WLCSP and BGA packaged products
employ special Pb-free material sets; molding compounds/die
attach materials and SnAgCu - e1 solder ball terminals, which
are RoHS compliant and compatible with both SnPb and Pb-free
soldering operations. Intersil Pb-free WLCSP and BGA packaged
products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
3. For Moisture Sensitivity Level (MSL), please see device
information page for ISL99203. For more information on MSL
please see tech brief TB363.
December 17, 2009
FN7547.0
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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