ISL6596 Datasheet, PDF (1/11 Pages) Intersil Corporation – Synchronous Rectified MOSFET Driver

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Data Sheet
January 22, 2010
ISL6596
FN9240.1
Synchronous Rectified MOSFET Driver
The ISL6596 is a high frequency, MOSFET driver optimized
to drive two N-Channel power MOSFETs in a synchronous
buck converter topology. This driver combined with Intersil’s
Multi-Phase Buck PWM controllers forms a complete single-
stage core-voltage regulator solution with high efficiency
performance at high switching frequency for advanced
microprocessors.
The IC is biased by a single low voltage supply (5V),
minimizing driver switching losses in high MOSFET gate
capacitance and high switching frequency applications.
Each driver is capable of driving a 3nF load with less than
10ns rise/fall time. Bootstrapping of the upper gate driver is
implemented via an internal low forward drop diode,
reducing implementation cost, complexity, and allowing the
use of higher performance, cost effective N-Channel
MOSFETs. Adaptive shoot-through protection is integrated
to prevent both MOSFETs from conducting simultaneously.
The ISL6596 features 4A typical sink current for the lower
gate driver, enhancing the lower MOSFET gate hold-down
capability during PHASE node rising edge, preventing power
loss caused by the self turn-on of the lower MOSFET due to
the high dV/dt of the switching node.
The ISL6596 also features an input that recognizes a
high-impedance state, working together with Intersil
multi-phase 3.3V or 5V PWM controllers to prevent negative
transients on the controlled output voltage when operation is
suspended. This feature eliminates the need for the schottky
diode that may be utilized in a power system to protect the
load from negative output voltage damage.
Applications
• Core Voltage Supplies for Intel® and AMD®
Microprocessors
• High Frequency Low Profile High Efficiency DC/DC
Converters
• High Current Low Voltage DC/DC Converters
• Synchronous Rectification for Isolated Power Supplies
Related Literature
• Technical Brief TB389 “PCB Land Pattern Design and
Surface Mount Guidelines for QFN (MLFP) Packages”
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
Features
• Drives Two N-Channel MOSFETs
• Adaptive Shoot-Through Protection
• 0.4Ω On-Resistance and 4A Sink Current Capability
• Supports High Switching Frequency
• Fast Output Rise and Fall Time
• Low Tri-State Hold-Off Time (20ns)
• Support 3.3V and 5V PWM Input
• Low Quiescent Supply Current
• Power-On Reset
• Expandable Bottom Copper Pad for Heat Spreading
• Dual Flat No-Lead (DFN) Package
- Compliant to JEDEC PUB95 MO-220 QFN-Quad Flat
No Leads-Product Outline
- Near Chip-Scale Package Footprint; Improves PCB
Efficiency and Thinner in Profile
• Pb-Free (RoHS Compliant)
Ordering Information
PART
NUMBER
(Note)
TEMP
PART RANGE
MARKING (°C)
PACKAGE
PKG.
DWG. #
ISL6596CBZ* 6596 CBZ 0 to +70 8 Ld SOIC
M8.15
ISL6596CRZ* 596Z
0 to +70 10 Ld 3x3 DFN L10.3x3C
ISL6596IBZ* 6596 IBZ -40 to +85 8 Ld SOIC
M8.15
ISL6596IRZ* 96IZ
-40 to +85 10 Ld 3x3 DFN L10.3x3C
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on
reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets, molding compounds/die attach
materials, and 100% matte tin plate plus anneal (e3 termination finish,
which is RoHS compliant and compatible with both SnPb and Pb-free
soldering operations). Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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