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ISL6415 Datasheet, PDF (1/2 Pages) Intersil Corporation – Triple Output Regulator with Single Synchronous Buck and Dual LDO
®
PRELIMINARY
Data Sheet
December 27, 2004
ISL6415
FN9145.0
Triple Output Regulator with Single
Synchronous Buck and Dual LDO
The ISL6415 is a highly integrated triple output regulator
which provides a single chip solution for wireless chipset
power management. The device integrates a high efficiency
synchronous buck regulator with two ultra low noise LDO
regulators. The IC accepts an input voltage range of 3.0V to
3.6V and provides three regulated output voltages: 1.2V
(PWM), 1.8V (LDO1), and another ultra-clean 1.8V (LDO2).
The Synchronous current mode PWM regulator with
integrated N- and P- channel power MOSFET provides pre-
set 1.2V for BBP/MAC core supply. Synchronous
rectification with internal MOSFETs is used to achieve higher
efficiency and reduced number of external components.
Operating frequency is typically 750kHz allowing the use of
smaller inductor and capacitor values. The device can be
synchronized to an external clock signal in the range of
500kHz to 1MHz. The PG_PWM output indicates loss of
regulation on PWM output.
The ISL6415 also has two LDO regulators which use an
internal PMOS transistor as the pass device. LDO2 features
ultra low noise that does not typically exceed 30µV RMS to
aid VCO stability. The EN_LDO pin controls LDO1 and
LDO2 outputs. The ISL6415 also integrates a RESET
function, which eliminates the need for additional RESET IC
required in WLAN applications. The IC asserts a RESET
signal whenever the VIN supply voltage drops below a
preset threshold, keeping it asserted for at least 25ms after
VIN has risen above the reset threshold. The PG_LDO
output indicates loss of regulation on either of the two LDO
outputs. Other features include overcurrent protection for all
three outputs and thermal shutdown.
High integration and the thin Quad Flat No-lead (QFN)
package makes ISL6415 an ideal choice to power many of
today’s small form factor industry standard wireless cards
such as PCMCIA, mini-PCI and Cardbus-32.
Ordering Information
TEMP.
PART NUMBER* RANGE (°C)
PACKAGE
PKG.
DWG. #
ISL6415IR
-40 to 85 24 Ld QFN
L24.4x4B
ISL6415IRZ (Note) -40 to 85 24 Ld QFN (Pb-free) L24.4x4B
*For tape and reel, add “-TK” or “-T5K” suffix.
NOTE: Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with
both SnPb and Pb-free soldering operations. Intersil Pb-free products
are MSL classified at Pb-free peak reflow temperatures that meet or
exceed the Pb-free requirements of IPC/JEDEC J STD-020.
Features
• Fully Integrated Synchronous Buck Regulator + Dual LDO
• High Output Current (For QFN package)
- PWM, 1.2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400mA
- LDO1, 1.8V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300mA
- LDO2, 1.8V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 200mA
• Ultra-Compact DC-DC Converter Design
• Stable with Small Ceramic Output Capacitors
• High Conversion Efficiency
• Low Shutdown Supply Current
• Ultra-Low Dropout Voltage for LDOs
- LDO1, 1.8V. . . . . . . . . . . . . . . . 125mV (typ.) at 300mA
- LDO2, 1.8V. . . . . . . . . . . . . . . . 100mV (typ.) at 200mA
• Ultra-Low Output Voltage Noise
- <30µVRMS (typ.) for LDO2 (VCO Supply)
• PG_LDO, PG_PWM and PG_PWM outputs
• Extensive Circuit Protection and Monitoring Features
- Overvoltage protection
- Overcurrent protection
- Shutdown
- Thermal Shutdown
• Integrated RESET output for microprocessor reset
• Proven Reference Design for Total WLAN System
Solution
• QFN Package
- Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat
No Leads - Product Outline
- Near Chip-Scale Package Footprint Improves PCB
Efficiency and Is Thinner in Profile
• Pb-Free Available (RoHS Compliant)
Applications
• WLAN Cards
- PCMCIA, Cardbus-32, Mini-PCI Cards
- Compact Flash Cards
• Liberty Chipset
• Hand-Held Instruments
Related Literature
• TB363 - Guidelines for Handling and Processing Moisture
Sensitive Surface Mount Devices (SMDs)
• TB389 - PCB Land Pattern Design and Surface Mount
Guidelines for QFN Packages
Final pinout and specifications are subject to change.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Copyright Intersil Americas Inc. 2004. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.