ISL6209 Datasheet, PDF (1/10 Pages) Intersil Corporation – High Voltage Synchronous Rectified Buck MOSFET Driver

®
Data Sheet
March 2004
ISL6209
FN9132
High Voltage Synchronous Rectified Buck
MOSFET Driver
The ISL6209 is a high frequency, dual MOSFET driver,
optimized to drive two N-Channel power MOSFETs in a
synchronous-rectified buck converter topology in mobile
computing applications. This driver, combined with an Intersil
Multi-Phase Buck PWM controller, such as ISL6216, ISL6244,
and ISL6247, forms a complete single-stage core-voltage
regulator solution for advanced mobile microprocessors.
The ISL6209 features 4A typical sink current for the lower gate
driver. The 4A typical sink current is capable of holding the
lower MOSFET gate during the PHASE node rising edge to
prevent the shoot-through power loss caused by the high dv/dt
of the PHASE node. The operation voltage matches the 30V
breakdown voltage of the MOSFETs commonly used in mobile
computer power supplies.
The ISL6209 also features a three-state PWM input that,
working together with most of Intersil multiphase PWM
controllers, will prevent a negative transient on the output
voltage when the output is being shut down. This feature
eliminates the Schottky diode, that is usually seen in a
microprocessor power system for protecting the
microprocessor, from reversed-output-voltage damage.
The ISL6209 has the capacity to efficiently switch power
MOSFETs at frequencies up to 2MHz. Each driver is capable of
driving a 3000pF load with a 8ns propagation delay and less
than a 10ns transition time. This product implements
bootstrapping on the upper gate with an internal bootstrap
Schottky diode, reducing implementation cost, complexity, and
allowing the use of higher performance, cost effective
N-Channel MOSFETs. Programmable dead-time with gate
threshold monitoring is integrated to prevent both MOSFETs
from conducting simultaneously.
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
• Technical Brief TB389 “PCB Land Pattern Design and
Surface Mount Guidelines for QFN Packages”
Features
• Drives Two N-Channel MOSFETs
• Shoot-Through Protection
- Active Gate Threshold Monitoring
- Programmable Dead-Time
• 30V Operation Voltage
• 0.4Ω On-Resistance and 4A Sink Current Capability
• Supports High Switching Frequency
- Fast Output Rise Time
- Propagation Delay 8ns
• Three-State PWM Input for Power Stage Shutdown
• Internal Bootstrap Schottky Diode
• QFN Package:
- Compliant to JEDEC PUB95 MO-220
QFN - Quad Flat No Leads - Package Outline
- Near Chip Scale Package footprint, which improves
PCB efficiency and has a thinner profile
• Pb-Free Available as an Option
Applications
• Core Voltage Supplies for Intel and AMD® Mobile
Microprocessors
• High Frequency Low Profile DC-DC Converters
• High Current Low Output Voltage DC-DC Converters
• High Input Voltage DC-DC Converter
Ordering Information
PART #
TEMP. RANGE
PKG.
(°C)
PACKAGE DWG. #
ISL6209CB
-10 to 100 8 Ld SOIC M8.15
ISL6209CBZ (Note)
-10 to 100
8 Ld SOIC M8.15
(Pb-free)
ISL6209CB-T
8 Ld SOIC Tape and Reel
ISL6209CBZ-T (Note) 8 Ld SOIC Tape and Reel (Pb-free)
ISL6209CR
-10 to 100 8 Ld 3x3 QFN L8.3x3
ISL6209CRZ (Note)
-10 to 100
8 Ld 3x3 QFN L8.3x3
(Pb-free)
ISL6209CR-T
8 Ld QFN Tape and Reel
ISL6209CRZ-T (Note) 8 Ld QFN Tape and Reel (Pb-free)
NOTE: Intersil Pb-free products employ special Pb-free material
sets; molding compounds/die attach materials and 100% matte tin
plate termination finish, which is compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J Std-020B.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Copyright © Intersil Americas Inc. 2004. All Rights Reserved. Intel® is a registered trademark of Intel Corporation.
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