ISL55110_0712 Datasheet, PDF (1/15 Pages) Intersil Corporation – Dual, High Speed MOSFET Driver

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Data Sheet
ISL55110, ISL55111
December 12, 2007
FN6228.2
Dual, High Speed MOSFET Driver
The ISL55110 and ISL55111 are dual high speed MOSFET
drivers intended for applications requiring accurate pulse
generation and buffering. Target applications include
Ultrasound, CCD Imaging, Automotive Piezoelectric
distance sensing and clock generation circuits.
With a wide output voltage range and low ON-resistance,
these devices can drive a variety of resistive and capacitive
loads with fast rise and fall times, allowing high speed
operation with low skew, as required in large CCD array
imaging applications.
The ISL55110 and ISL55111 are compatible with 3.3V and
5V logic families and incorporate tightly controlled input
thresholds to minimize the effect of input rise time on output
pulse width. The ISL55110 has a pair of in-phase drivers
while the ISL55111 has two drivers operating in antiphase.
Both inputs of the device have independent inputs to allow
external time phasing if required.
The ISL55110 has a power-down mode for low power
consumption during equipment standby times, making it
ideal for portable products.
The ISL55110 and ISL55111 are available in 16 Ld Exposed
pad QFN packaging and 8 Ld TSSOP. Both devices are
specified for operation over the full -40°C to +85°C
temperature range.
Functional Block Diagram
ISL55110 and ISL55111 DUAL DRIVER
o VDD
VH
o
o ^IN-A
OA _o
o HIZ-QFN*
o ^IN-B
*
o ^{POWER DOWN}
OB
o
GND
o
*HIZ AVAILABLE IN QFN PACKAGE ONLY
*ISL55111 IN-B IS INVERTING
Features
• 5V to 12V Pulse Magnitude
• High Current Drive 3.5A
• 6ns Minimum Pulse Width
• 1.5ns Rise and Fall Times, 100pF Load
• Low Skew
• 3.3V and 5V Logic Compatible
• In-Phase and Anti-Phase Outputs
• Small QFN and TSSOP Packaging
• Low Quiescent Current
• Pb-free (RoHS compliant)
Applications
• Ultrasound MOSFET Driver
• CCD Array Horizontal Driver
• Automotive Piezo Driver Applications
• Clock Driver Circuits
Ordering Information
PART
NUMBER
(Note)
PART
TEMP. PACKAGE
MARKING RANGE (°C) (Pb-Free)
PKG.
DWG. #
ISL55110IRZ* 55 110IRZ -40 to +85 16 Ld QFN L16.4x4A
ISL55110IVZ* 55110 IVZ -40 to +85 8 Ld TSSOP M8.173
ISL55111IRZ* 55 11IRZ -40 to +85 16 Ld QFN L16.4x4A
ISL55111IVZ* 55111 IVZ -40 to +85 8 Ld TSSOP M8.173
*Add “-T” suffix for tape and reel. Please refer to TB347 for details on
reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ
special Pb-free material sets; molding compounds/die attach
materials and 100% matte tin plate PLUS ANNEAL - e3 termination
finish, which is RoHS compliant and compatible with both SnPb and
Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed
the Pb-free requirements of IPC/JEDEC J STD-020.
1
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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