E28.6A-S Datasheet, PDF (1/1 Pages) Intersil Corporation – Plastic Packages for Integrated Circuits

Plastic Packages for Integrated Circuits
Dual-In-Line Plastic Packages (PDIP)
INDEX
AREA
N
12 3
E1
N/2
D
BASE
PLANE
SEATING
PLANE
A
L
CL
B1
B
A1
e_A
e
α
C
NOTES:
1. Controlling Dimensions: MILLIMETER. In case of conflict be-
tween English and Metric dimensions, the metric dimensions
control.
2. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS-3.
3. D and E1 dimensions do not include mold flash or protrusions.
4. e_A is measured with the leads constrained to be perpendicular
to base plane.
5. N is the maximum number of terminal positions.
E28.6A-S
28 LEAD DUAL-IN-LINE PLASTIC PACKAGE
INCHES
MILLIMETERS
SYMBOL MIN
MAX
MIN
MAX NOTES
A
0.178
0.196
4.5
5.0
2
A1
0.020
-
0.50
-
2
B
0.016
0.023
0.40
0.60
-
B1
0.042
0.053
1.05
1.35
-
C
0.008
0.13
0.20
0.35
-
D
1.485
1.503 37.7
38.2
3
E1
0.508
0.523 12.9
13.3
3
e
0.100 BSC
2.54 BSC
-
e_A
0.600 BSC
15.24 BSC
4
L
0.119
-
3.0
-
2
N
28
28
5
α
0^o
15^o
0^o
15^o
-
Rev. 1 4/95
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