VS-HFA25TB60PBF Datasheet, PDF (2/6 Pages) InterFET Corporation – Ultrafast, Soft Recovery Diode

HFA25TB60
Bulletin PD-2.339 rev. A 11/00
Electrical Characteristics @ T_J = 25°C (unless otherwise specified)
Parameter
Min Typ Max Units
Test Conditions
VBR
Cathode Anode Breakdown Voltage 600
V IR = 100µA
1.3 1.7
IF = 25A
VFM
Max Forward Voltage
1.5 2.0 V IF = 50A
See Fig. 1
1.3 1.7
IF = 25A, TJ = 125°C
IRM
Max Reverse Leakage Current
1.5 20
600 2000
µA
VR = VR Rated
See Fig. 2
TJ = 125°C, VR = 0.8 x VR RatedD Rated
CT
Junction Capacitance
55 100 pF VR = 200V
See Fig. 3
LS
Series Inductance
Measured lead to lead 5mm from
8.0
nH _{package body}
Dynamic Recovery Characteristics @ T_J = 25°C (unless otherwise specified)
trr
trr1
trr2
IRRM1
IRRM2
Qrr1
Qrr2
di(rec)M/dt1
di(rec)M/dt2
Parameter
Reverse Recovery Time
See Fig. 5, 6 & 16
Peak Recovery Current
See Fig. 7& 8
Reverse Recovery Charge
See Fig. 9 & 10
Peak Rate of Fall of Recovery Current
During tb
See Fig. 11 & 12
Min Typ Max Units
Test Conditions
23
IF = 1.0A, dif/dt = 200A/µs, VR = 30V
50 75 ns TJ = 25°C
105 160
TJ = 125°C
IF = 25A
4.5 10
8.0 15
A
TJ = 25°C
TJ = 125°C
VR = 200V
112 375 _nC TJ = 25°C
420 1200
TJ = 125°C
dif/dt = 200A/µs
250
160
A/µs
TJ = 25°C
TJ = 125°C
Thermal - Mechanical Characteristics
Tlead!
RthJC
R_thJA"
RthCS#
Wt
Parameter
Min
Typ
Max Units
Lead Temperature
300
°C
Thermal Resistance, Junction to Case
Thermal Resistance, Junction to Ambient
1.0
80
K/W
Thermal Resistance, Case to Heat Sink
0.5
Weight
Mounting Torque
2.0
0.07
6.0
5.0
g
(oz)
12
Kg-cm
10
lbf•in
! 0.063 in. from Case (1.6mm) for 10 sec
" Typical Socket Mount
# Mounting Surface, Flat, Smooth and Greased
2
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