82567GBE Datasheet, PDF (3/33 Pages) Intel Corporation – 82567 GbE Physical Layer Transceiver (PHY)

Datasheet—82567
Contents
1.0 Introduction .............................................................................................................. 5
1.1 Scope ................................................................................................................ 6
1.2 Reference Documents .......................................................................................... 6
1.3 Product Codes..................................................................................................... 6
2.0 Signal Descriptions .................................................................................................... 7
2.1 Signal Type Definitions......................................................................................... 7
2.2 GLCI Interface Pins.............................................................................................. 7
2.3 LCI Interface Pins................................................................................................ 8
2.4 Miscellaneous Pins ............................................................................................... 8
2.5 PHY Pins ............................................................................................................ 9
2.5.1 LED Pins ................................................................................................. 9
2.5.2 Analog Pins ............................................................................................. 9
2.5.3 Testability Pins......................................................................................... 9
2.6 Power Supply Pins ............................................................................................. 10
3.0 Features .................................................................................................................. 11
3.1 Feature Matrix and Product Information................................................................ 11
3.2 Power Saving Features....................................................................................... 12
3.2.1 Intel^® Auto Connect Battery Saver (ACBS) ................................................ 12
3.2.2 Link Speed Battery Saver ........................................................................ 12
3.2.3 System Idle Power Saver (SIPS) .............................................................. 13
3.2.4 Low Power Link Up (LPLU) ....................................................................... 13
3.2.5 LAN Disable ........................................................................................... 14
4.0 Voltage, Temperature, and Timing Specifications .................................................... 16
4.1 Recommended Operating Conditions .................................................................... 16
4.2 DC and AC Characteristics .................................................................................. 16
4.3 LED Electrical Specification ................................................................................. 16
4.4 Crystal Specifications ......................................................................................... 17
4.5 Oscillator Specifications...................................................................................... 19
4.5.1 Oscillator High Voltage Configuration ........................................................ 19
4.6 Power Consumption ........................................................................................... 20
4.7 Power Delivery.................................................................................................. 23
4.7.1 The 1.8 V-1.9 V Rail ............................................................................... 23
4.7.2 The 1.05 V Rail ...................................................................................... 23
4.7.3 Voltage Regulator Schematics .................................................................. 23
4.7.4 Voltage Regulator Power Supply Specifications ........................................... 24
4.7.5 PNP Specifications .................................................................................. 25
4.7.6 Power Sequencing .................................................................................. 25
4.8 Timing Parameters ............................................................................................ 26
4.8.1 Timing Requirements .............................................................................. 26
4.8.2 Timing Guarantees ................................................................................. 26
5.0 Package and Pinout Information ............................................................................. 27
5.1 Package Information.......................................................................................... 27
5.2 Thermal ........................................................................................................... 27
5.3 Internal Pull-Up Resistors ................................................................................... 28
5.4 Visual Pin Assignments....................................................................................... 29
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