DG33BU Datasheet, PDF (25/84 Pages) Intel Corporation – Technical Product Specification

Product Description
1.10.1 Audio Subsystem Software
Audio software and drivers are available from Intel’s World Wide Web site.
For information about
Obtaining audio software and drivers
Refer to
Section 1.2, page 15
1.10.2 Audio Connectors and Headers
The board contains audio connectors on the back panel and audio headers on the
component side of the board. The front panel audio header provides mic in and line
out signals for the front panel. Microphone bias is supported for both the front and
back panel microphone connectors.
The front/back panel audio connectors are configurable through the audio device
drivers. The available configurable audio ports are shown in Figure 4.
Item
A
B
C
Description
Line in
Line out
Mic in
Figure 4. Back Panel Audio Connector Options
NOTE
The back panel audio line out connector is designed to power headphones or amplified
speakers only. Poor audio quality occurs if passive (non-amplified) speakers are
connected to this output.
For information about
The location of the front panel audio header
The signal names of the front panel audio header
The back panel audio connectors
Refer to
Figure 10, page 42
Table 16, page 45
Section 2.2.1, page 41
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