D64569-007 Datasheet, PDF (18/76 Pages) Intel Corporation – Intel Server Board S5000VCL

Intel^® Server Board S5000VCL TPS
Functional Architecture
3.1.2.1
Processor Population Rules
When two processors are installed, both must be of identical revision, core voltage, and
bus/core speed. When only one processor is installed, it must be in the socket labeled CPU1.
The other socket must be empty.
The board provides up to 90A max, 70A TDC per processor. Processors with higher current
requirements are not supported.
3.1.2.2
Common Enabling Kit (CEK) Design Support
The server board complies with Intel’s common enabling kit (CEK) processor mounting and heat
sink retention solution. The server board ships with a CEK spring snapped onto the underside of
the server board, beneath each processor socket. The heat sink attaches to the CEK, over the
top of the processor and the thermal interface material (TIM). See the figure below for the
stacking order of the chassis, CEK spring, server board, TIM, and heat sink.
The CEK spring is removable, allowing for the use of non-Intel heat sink retention solutions.
Heatsink assembly
Thermal Interface
Material (TIM)
Server Board
TP02091
CEK Spring
Chassis
AF001010
Figure 5. CEK Processor Mounting
Revision 2.3
Intel order number: D64569-007
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