RU82566DM Datasheet, PDF (1/30 Pages) Intel Corporation – 82566 Gigabit Platform LAN Connect

82566 Gigabit Platform LAN Connect
Networking Silicon
Datasheet
Product Features
■ IEEE 802.3ab compliant
— Robust operation over the installed base
of Category-5 (Cat-5) twisted pair
cabling
■ Robust end to end connections over various
cable lengths
■ Full duplex at 10, 100, or 1000 Mbps and
half duplex at 10 or 100 Mbps.
■ IEEE 802.3ab Auto-negotiation with Next
Page support
— Automatic link configuration including
speed, duplex, and flow control
■ 10/100 downshift
— Automatic link speed adjustment with
poor quality cable
■ Automatic MDI crossover
— Helps to correct for infrastructure issues
■ Advanced Cable Diagnostics
— Improved end-user troubleshooting
■ Footprint compatible with 82562V devices
for a single-board dual design (Gigabit and
10/100)
■ LCI interface for a very low power 10/100
link
■ Gigabit LAN Connect Interface
— Low pin count, high speed interface
with special low power idle modes
— Allows PHY placement proximity to I/O
back panel.
■ 3 LED outputs
— Link and Activity indications (10, 100,
and 1000 Mbps)
■ Clock supplied to MAC
— Cost optimized design
■ Full chip power down
— Support for lowest power state
■ 81-pin, 1.0 mm pitch, 10 mm x 10 mm
FCMMAP (BGA) Package
— Smaller footprint and lower power
dissipation compared to multi-chip
MAC and PHY solutions. Footprint
compatible with the Intel^® 82562V
Platform LAN Connect device
■ Integrated voltage regulator and power
supply control, which can be powered from
a single 3.3V DC rail
■ Operating temperatures: 0° C to 70° C and
0° C to 55° C (with internal regulator) –
heat sink or forced airflow not required
— Simple Thermal Design
■ Power Consumption less than 1.16 Watts
(silicon power)
317436-003
Revision 2.4